Electronic device packaging assembly

An electronic device package assembly comprising:

• a base member;
• a cover member;
• a lead frame having a plurality of leads disposed between said base member and said cover member;
• an electronic device disposed between said base member and said cover member and electrically attached to said leads;
• bonding means for bonding said base member and said cover member to the lead frame, said bonding means being constructed from material having a liquid state under certain temperature conditions associated with assembly of said electronic device package assembly;
• spacer means disposed between said lead frame and said base member and said lead frame and said cover member for maintaining said base member and said cover member at a predetermined spacing from said lead frame, said spacer means being constructed from material having a solid state under all temperature conditions associated with assembly of said electronic device package assembly whereby said spacer means maintains said base member and said cover member at said predetermined spacing from said lead frame during periods when said bonding means is in a liquid state, and said spacer means comprising an integrally formed portion of said lead frame.

An electronic device package assembly comprising:

• a base member;
• a cover member;
• a lead frame having a plurality of leads disposed between said base member and said cover member;
• an electronic device disposed between said base member and said cover member and electrically attached to said leads;
• bonding means for bonding said base member and said cover member to the lead frame, said bonding means being constructed from material having a liquid state under certain temperature conditions associated with assembly of said electronic device package assembly;
• spacer means disposed between said lead frame and said base member and said lead frame and said cover member for maintaining said base member and said cover member at a predetermined spacing from said lead frame, said spacer means being constructed from material having a solid state under all temperature conditions associated with assembly of said electronic device package assembly whereby said spacer means maintains said base member and said cover member at said predetermined spacing from said lead frame during periods when said bonding means is in a liquid state, and said spacer means being circumscribingly contacted by said bonding means.

A method of forming an electronic package of the type having an electronic device disposed between a base member and a cover member comprising the steps of:

• forming a lead frame;
• positioning spacers between the lead frame and at least one of the members so as to maintain the lead frame and the at least one member at a predetermined spacing;
• and
• bonding the at least one member to the lead frame while maintaining the spacers in a solid state.

A method of forming an electronic package of the type having an electronic device disposed between a base member and a cover member comprising the steps of:

• forming a lead frame;
• positioning spacers between the lead frame and at least one of the members so as to maintain the lead frame and the at least one member at a predetermined spacing;
• and
• bonding the at least one member to the lead frame while maintaining the spacers in a solid state, wherein the step of forming the lead frame comprises forming the spacers from portions of the lead frame.

A method of forming an electronic package of the type having an electronic device disposed between a base member and a cover member comprising the steps of:

• forming a lead frame;
• positioning spacers between the lead frame and at least one of the members so as to maintain the lead frame and the at least one member at a predetermined spacing;
• and
• bonding the at least one member to the lead frame while maintaining the spacers in a solid state, wherein the step of bonding the at least one member to the lead frame comprises applying a bonding matrix in circumscribing contact with said spacers.

An electronic device package assembly comprising:

• abase member having a planar surface portion and an outer periphery;
• a cover member having a planar surface portion and an outer periphery, said cover member being aligned and generally coextensive with said base member, said planar surface portion of said cover member being positioned-parallel to said planar surface portion of said base member;
• a lead frame having a first surface portion and an opposing second surface portion and having a plurality of leads extending radially between an outer peripheral portion of the lead frame and an inner peripheral portion of the lead frame, said inner peripheral portion of said lead frame defining a central lead frame opening, said lead frame being disposed between said base member and said cover member with said outer peripheral portion of said lead frame extending beyond said outer peripheries of said base member and said cover member;
• said lead frame comprising integrally formed spacer means extending axially outwardly from said first and second surface portions of said lead frame into contacting engagement with said planar surface portions of said base member and said cover member for maintaining said planar surface portions of said base member and said cover member in parallel relationship;
• an electronic device disposed between said base member and said cover member in alignment with said central lead frame opening and electrically attached to said leads;
• first bonding means positioned generally concentrically of said central lead frame opening and in contact with said spacer means projecting from said first surface portion of said lead frame for bonding said base member planar surface portion to said first surface portion of said lead frame;
• and
• second bonding means positioned generally concentrically of said central lead frame opening and in contact with said spacer means projecting from said second surface portion of said lead frame for bonding said cover member planar surface portion to said second surface portion of said lead frame.