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US 2026/0271712 A1Published application
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorTaketo NISHIYAMA
Life of this patent
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Abstract
A semiconductor device according to the present disclosure includes: a semiconductor module having a heatsink plate placed on the lower surface side; a heatsink having the semiconductor module mounted on the upper surface; a heat dissipating material interposed between the heatsink plate and the heatsink; and a spacer placed between the semiconductor module and the heatsink. In the semiconductor device, the spacer is placed on the outer side of the heat dissipating material in a planar view.
Claims12
A semiconductor device comprising:
- a semiconductor module having a heatsink plate placed on a lower surface side;
- a heatsink having the semiconductor module mounted on an upper surface;
- a heat dissipating material interposed between the heatsink plate and the heatsink;
- and
- a spacer placed between the semiconductor module and the heatsink, wherein
- the spacer is placed on an outer side of the heat dissipating material in a planar view.
3 more elements
A semiconductor device mounted on a heatsink, the semiconductor device comprising:
- a semiconductor module having a heatsink plate placed on a lower surface side;
- a heat dissipating material placed on a lower surface of the heatsink plate;
- and
- a spacer provided on the semiconductor module, wherein
- the spacer is placed on an outer side of the heat dissipating material in a planar view.
2 more elements
Dependencies are inferred from the claim text.