Method of making a post molded cavity package with internal dam bar for integrated circuit

Abstract

A method of producing a cavity package around an assembled semiconductor device is disclosed. The method includes providing a chip attach pad having a plurality of chip attach pad straps, each strap extending outwardly from the outer edge of the chip attach pad and spaced about the edge of the bar pad; mounting integrated circuits having bond pads on the chip attach pad; molding a package material onto a central portion of lead fingers and the chip attach pad straps to grip and surround each lead finger with package material, with a portion of each lead finger extending externally from the ring at both the exterior and interior thereof and to secure the bar pad straps therein; electrically coupling the bond pads to the portion of desired ones of the lead fingers extending toward the interior of the ring; and enclosing both ends of the ring to provide a cavity in the ring to suspend a chip attach pad with the integrated circuit thereon within the cavity with the chip attach straps. Heat sinks can also be used to promote high levels of thermal dissipation.

Dependencies are inferred from the claim text.