Current sensor with inverted shielding element

A semiconductor device comprising:

• a dielectric housing;
• a semiconductor chip disposed within the dielectric housing, the semiconductor chip having first and second metal electrodes disposed on opposing surfaces thereof;
• a first lead frame having a first end extending out of the dielectric housing and having a second end terminating in a die pad upon which the semiconductor chip is mounted, wherein a top surface of the die pad is planar and includes a cavity defined by a lip extending outwardly from the top surface of the die pad, the cavity having a first quantity of solder disposed therein, and wherein the first quantity of solder electrically connects the die pad to the first metal electrode of the semiconductor chip;
• a second lead frame having a first end extending out of the dielectric housing and having a second end disposed adjacent the semiconductor chip;
• and
• a clip having a first end connected to the second of the lead frame and a second end extending over the semiconductor chip, wherein a bottom surface of the second end of the clip includes a recess having a second quantity of solder disposed therein, and wherein the second quantity of solder electrically connects the clip to the second metal electrode of the semiconductor chip.