H10W 76/15
Containers comprising an insulating or insulated base
H10W76/15 (Containers comprising an insulating or insulated base) appears on 2,418 US grants and 2,459 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,418
- Published applications
- 2,459
- Assignees
- 729
- Inventors
- 4,858
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 7 | 0 |
| 1978 | 11 | 0 |
| 1979 | 10 | 0 |
| 1980 | 7 | 0 |
| 1981 | 16 | 0 |
| 1982 | 15 | 0 |
| 1983 | 11 | 0 |
| 1984 | 8 | 0 |
| 1985 | 16 | 0 |
| 1986 | 9 | 0 |
| 1987 | 24 | 0 |
| 1988 | 18 | 0 |
| 1989 | 25 | 0 |
| 1990 | 21 | 0 |
| 1991 | 30 | 0 |
| 1992 | 27 | 0 |
| 1993 | 18 | 0 |
| 1994 | 34 | 0 |
| 1995 | 28 | 0 |
| 1996 | 23 | 0 |
| 1997 | 27 | 0 |
| 1998 | 33 | 0 |
| 1999 | 23 | 0 |
| 2000 | 24 | 0 |
| 2001 | 35 | 15 |
| 2002 | 40 | 36 |
| 2003 | 39 | 29 |
| 2004 | 42 | 46 |
| 2005 | 34 | 34 |
| 2006 | 30 | 36 |
| 2007 | 30 | 43 |
| 2008 | 20 | 49 |
| 2009 | 30 | 49 |
| 2010 | 40 | 55 |
| 2011 | 31 | 56 |
| 2012 | 49 | 56 |
| 2013 | 56 | 63 |
| 2014 | 58 | 82 |
| 2015 | 70 | 88 |
| 2016 | 83 | 118 |
| 2017 | 106 | 125 |
| 2018 | 123 | 131 |
| 2019 | 141 | 145 |
| 2020 | 137 | 166 |
| 2021 | 117 | 186 |
| 2022 | 125 | 179 |
| 2023 | 132 | 244 |
| 2024 | 143 | 172 |
| 2025 | 141 | 156 |
| 2026 | 89 | 100 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing and module of a semiconductor power module with heat dissipation function29 Sep 2026US 12,751,285 B2Hitachi Energy Ltd
- Semiconductor module29 Sep 2026US 12,751,318 B2Fuji Electric Co., Ltd.
- Semiconductor packaging15 Sep 2026US 12,740,414 B2Chung Ang University Industry Academic Cooperation Foundation
- Power component and system with the power component25 Aug 2026US 12,716,963 B2ABB Schweiz AG
- Direct substrate-side cooling in power device module25 Aug 2026US 12,721,168 B2Semiconductor Components Industries, LLC
- Semiconductor package including connecting pads8 Oct 2026US 2026/0314451 A1Samsung Electronics Co., Ltd.
- Die attachment film, dicing die bonding film, and semiconductor device manufacturing method1 Oct 2026US 2026/0305443 A1Resonac Corporation
- Peltier element and semiconductor package10 Sep 2026US 2026/0271719 A1Sony Semiconductor Solutions Corporation
- Semiconductor assembly having a semiconductor element and a substrate10 Sep 2026US 2026/0271723 A1Siemens Aktiengesellschaft
- Board apparatus, electronic apparatus, electronic device, method for manufacturing electronic apparatus, and method for manufacturing electronic device10 Sep 2026US 2026/0271761 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Leadless image sensor package structure and method for making the same353US 6,384,472 B1Siliconware Precision Industries Co., Ltd. · 2002
- Integrated circuit package having adhesive bead supporting planar lid above planar substrate332US 6,268,654 B1Ankor Technology, Inc. · 2001
- Method of making a cavity ball grid array apparatus317US 6,326,244 B1Micron Technology, Inc. · 2001