H10W 76/153
Having interconnections in passages through the insulating or insulated base
Official title: having interconnections in passages through the insulating or insulated base
H10W76/153 (Having interconnections in passages through the insulating or insulated base) appears on 667 US grants and 653 published applications in this corpus.
Search patents in H10W- Granted patents
- 667
- Published applications
- 653
- Assignees
- 303
- Inventors
- 1,498
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 9 | 0 |
| 1998 | 6 | 0 |
| 1999 | 10 | 0 |
| 2000 | 11 | 0 |
| 2001 | 23 | 10 |
| 2002 | 20 | 17 |
| 2003 | 17 | 17 |
| 2004 | 20 | 26 |
| 2005 | 22 | 18 |
| 2006 | 19 | 19 |
| 2007 | 20 | 21 |
| 2008 | 12 | 22 |
| 2009 | 15 | 25 |
| 2010 | 16 | 38 |
| 2011 | 20 | 30 |
| 2012 | 33 | 27 |
| 2013 | 32 | 25 |
| 2014 | 26 | 21 |
| 2015 | 21 | 27 |
| 2016 | 17 | 26 |
| 2017 | 27 | 29 |
| 2018 | 31 | 28 |
| 2019 | 32 | 41 |
| 2020 | 40 | 47 |
| 2021 | 29 | 30 |
| 2022 | 21 | 20 |
| 2023 | 25 | 30 |
| 2024 | 18 | 18 |
| 2025 | 17 | 24 |
| 2026 | 10 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor module29 Sep 2026US 12,751,318 B2Fuji Electric Co., Ltd.
- Chip package with heat dissipation plate and manufacturing method thereof18 Aug 2026US 12,713,930 B2Stats Chippac Semiconductor (Jiangyin) Co., Ltd.
- Semiconductor package4 Aug 2026US 12,701,813 B2Sony Semiconductor Solutions Corporation
- Antenna module19 May 2026US 12,633,645 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Metal pocket fanout package5 May 2026US 12,622,313 B2QUALCOMM Incorporated
- Peltier element and semiconductor package10 Sep 2026US 2026/0271719 A1Sony Semiconductor Solutions Corporation
- Thermal management of optical components20 Aug 2026US 2026/0243981 A1Lumentum Technology UK Limited
- Semiconductor devices and methods of manufacturing semiconductor devices20 Aug 2026US 2026/0248031 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package with antenna16 Jul 2026US 2026/0206603 A1
- Integrated cooling assemblies with multifunctional layers and methods of manufacturing the same9 Jul 2026US 2026/0198316 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Leadless image sensor package structure and method for making the same353US 6,384,472 B1Siliconware Precision Industries Co., Ltd. · 2002
- Integrated circuit package having adhesive bead supporting planar lid above planar substrate332US 6,268,654 B1Ankor Technology, Inc. · 2001
- Method of making a cavity ball grid array apparatus317US 6,326,244 B1Micron Technology, Inc. · 2001
- High contact density ball grid array package for flip-chips265US 5,637,920 ALSI Logic Corporation · 1997