Peltier element and semiconductor package

Abstract

To improve cooling performance of a semiconductor chip cooled by a Peltier element while enabling electrical connection with the outside. The Peltier element includes a thermoelectric element, a heat dissipation substrate that dissipates heat generated by the thermoelectric element, a cooling substrate that is cooled by the thermoelectric element, and an inter-substrate wiring that connects the heat dissipation substrate and the cooling substrate to each other. A spacer substrate provided between the heat dissipation substrate and the cooling substrate may be further included, and the inter-substrate wiring may connect the heat dissipation substrate and the cooling substrate to each other via the spacer substrate. A first through electrode that is connected to the inter-substrate wiring and penetrates the cooling substrate may be further included. A second through electrode that is connected to the inter-substrate wiring and penetrates the heat dissipation substrate may be further included.

Dependencies are inferred from the claim text.