Semiconductor package with antenna

A method of forming a package comprising:

• attaching a stiffening layer over a first surface of a substrate of a redistribution layer, the substrate including a first surface and a second surface opposing the first surface with a conductive layer on the first surface of the substrate forming a set of antennas,
• wherein, after attaching the stiffening layer over the first surface of the substrate, the stiffening layer forms gaps over each antenna of the set of antennas such that each antenna of the set of antennas remains exposed on an outer surface of the package;
• and
• arranging a semiconductor die on a die attach site of the redistribution layer,
• wherein the semiconductor die forms communication channels for each of the set of antennas,
• wherein arranging the semiconductor die on the die attach site electrically couples the communication channels of the semiconductor die to the set of antennas of the conductive layer on the first surface of the substrate via the redistribution layer.

A method of forming a package comprising:

• providing a substrate including a first surface and a second surface opposing the first surface;
• forming a conductive layer on the first surface of the substrate forming a set of antennas;
• forming communication channels on a semiconductor die for each antenna of the set of antennas, each of the communication channels being electrically coupled to an associated antenna of the set of antennas by way of a redistribution layer that includes the substrate;
• mounting the semiconductor die being mounted on either the first surface or the second surface of the substrate,
• wherein the communication channels include at least one millimeter wave (mmWave) transmit channel and at least one mmWave receive channel;
• providing a set of electrical contacts on the second surface of the substrate, the redistribution layer further coupling the set of electrical contacts to the semiconductor die,
• wherein portions of the conductive layer outside the antennas are electrically coupled to a ground electrical contact of the set of electrical contacts by way of ground conductors formed on the substrate;
• providing a solder ball array over the set of electrical contacts, the solder ball array forming a flip chip ball grid array (FCBGA);
• and
• providing a metal stiffening layer adhered to the first surface of the substrate and electrically connected to grounded portions of the conductive layer outside the antennas, the metal stiffening layer forming gaps over each antenna of the set of antennas such that each antenna of the set of antennas is on an outer surface of the package.