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US 12,622,313 B2Granted
Metal pocket fanout package
AssigneeQUALCOMM Incorporated
InventorsHong Bok We, Joan Rey Villarba Buot, Sang-Jae Lee, Zhijie Wang
Life of this patent
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Abstract
Disclosed are examples of die packages that incorporate metal frames with metal pockets. One or more dies may be placed within the metal pockets. Due to the structural integrity provided by the metal frame, warpage is reduced or eliminated. As a result, die packages with thin dies may be fabricated. Further, due to the electrical conductivity provided by the metal frame, the metal frame may be used as an electrical shield to protect the dies.
Claims20
A die package, comprising:
- a metal frame comprising a metal cover and a plurality of metal walls, a metal pocket being formed in spaces below the metal cover and between adjacent metal walls;
- a die within the metal pocket, die connects of the die facing an open end of the metal pocket;
- a resin within the metal pocket, the resin encapsulating the die, and the die connects being exposed at the open end of the metal pocket through the resin, wherein the resin is in between the metal cover and the die, and wherein the resin covers all of a lower surface of the die other than portions covered by the die connects;
- and
- one or more redistribution layers (RDL) below the metal frame, each RDL comprising one or more vias and one or more traces formed in a dielectric,
- wherein one or more electrical paths are provided between the die and one or more components external to the die package through the die connects and through the one or more vias and the one or more traces of the one or more RDLs, and
- wherein a lower surface of the resin is above lower surfaces of the plurality of metal walls.
4 more elements
A method of fabricating a die package, the method comprising:
- providing a metal frame comprising a metal cover and a plurality of metal walls, a metal pocket being formed in a space below the metal cover and between adjacent metal walls;
- placing a die within the metal pocket, die connects of the die facing an open end of the metal pocket;
- providing a resin within the metal pocket, the resin encapsulating the die, and the die connects being exposed at the open end of the metal pocket through the resin, wherein the resin is in between the metal cover and the die, and wherein the resin covers all of a lower surface of the die other than portions covered by the die connects;
- and
- forming one or more redistribution layers (RDL) below the metal frame, each RDL comprising one or more vias and one or more traces formed in a dielectric,
- wherein one or more electrical paths are provided between the die and one or more components external to the die package through the die connects and through the one or more vias and the one or more traces of the one or more RDLs, and
- wherein a lower surface of the resin is above lower surfaces of the plurality of metal walls.
4 more elements
Dependencies are inferred from the claim text.