High-density electronic package, and method for making same

An electronic package for plural electronic devices comprising:

• a plurality of electronic devices, each said electronic device having a pattern of a plurality of contacts thereon;
• a plurality of flexible dielectric adhesive interposers each associated with at least one of said plurality of electronic devices, each including:
• at least one layer of flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi,
• a plurality of conductive vias through said layer of flexible dielectric adhesive, said plurality of conductive vias being in a pattern, wherein at least certain ones of said plurality of conductive vias correspond to ones of the contacts of the associated one of said plurality of electronic devices, and
• a metal foil on one surface of said layer of flexible dielectric adhesive, wherein said metal foil is patterned and is in electrical contact with ones of said conductive vias;
• wherein at least one of said plurality of conductive vias and said patterned metal foil includes external contacts adapted for connecting said flexible dielectric adhesive interposer to an external device;
• and means for connecting the contacts of each of said plurality of electronic devices to the certain ones of said conductive vias of the flexible dielectric adhesive interposer with which it is associated,
• wherein said plurality of flexible dielectric adhesive interposers are positioned adjacent each other and further comprising:
• means for connecting the external contacts of each of said plurality of flexible dielectric adhesive interposers to the external contacts of an adjacent one of said plurality of flexible dielectric adhesive interposers.

A flexible dielectric adhesive interposer comprising:

• a plurality of layers of flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi;
• a plurality of conductive vias through each of said layers of flexible dielectric adhesive, said plurality of conductive vias in each said layer of flexible dielectric adhesive being in a pattern corresponding at least in part to a pattern of said plurality of conductive vias of the adjacent layers of said flexible dielectric adhesive;
• and
• a metal foil between at least two of said layers of flexible dielectric adhesive, wherein said metal foil is patterned and is in electrical contact with ones of said conductive vias of each of the at least two of said layers of flexible dielectric adhesive.

An electronic package for plural electronic devices comprising:

• a plurality of electronic modules, each said electronic module having a predetermined pattern of a plurality of external contacts on first and second opposing surfaces thereof, wherein each said electronic module includes:
• an electronic device having a pattern of contacts thereon;
• a first flexible dielectric adhesive interposer including:
• at least one layer of flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi,
• a plurality of conductive vias through said layer of flexible dielectric adhesive, said plurality of conductive vias being in a pattern, wherein at least first ones of said plurality of conductive vias correspond to the contacts of said electronic device, and wherein at least second ones of said plurality of conductive vias correspond to the predetermined pattern of the plurality of external contacts,
• means for electrically connecting corresponding ones of the contacts of said electronic device to corresponding first ones of said plurality of conductive vias;
• and
• a metal foil on one surface of said at least one layer of flexible dielectric adhesive, wherein said metal foil is patterned to provide electrical conductors between corresponding first and second ones of said conductive vias;
• a second dielectric interposer having a central opening therein, wherein said first flexible dielectric adhesive interposer and said second dielectric interposer are adjacent each other with said electronic device disposed in the central opening of said second dielectric interposer, said second dielectric interposer including a plurality of conductive vias in a pattern, wherein at least first ones of said plurality of conductive vias correspond to the predetermined pattern of the plurality of external contacts, and
• means for electrically connecting the second ones of the conductive vias of said first flexible dielectric adhesive interposer to corresponding first ones of the conductive vias of the second dielectric interposer, wherein unconnected ends of the second ones of the conductive vias of said first flexible dielectric adhesive interposer and unconnected ends of the first ones of the conductive vias of the second dielectric interposer provide said external contacts, and
• means for electrically connecting the external contacts on the respective first surface of each of said plurality of electronic modules to the external contacts on the second surface of an adjacent one of said electronic modules, wherein said plurality of electronic modules are positioned adjacent each other and are electrically connected.

A method of making an electronic package for an electronic device comprising:

• providing a sheet of metal foil;
• providing at least one layer of a flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi on one surface of the sheet of metal foil, the layer of flexible dielectric adhesive having a plurality of via openings therein;
• building up conductive material on the metal foil to fill the via openings, thereby forming conductive vias therein;
• patterning the metal foil to form a pattern of contacts and conductors electrically connected to the conductive vias in the flexible dielectric adhesive layer;
• plating at least one of the conductive vias and the contacts of the patterned metal foil to provide external contacts;
• and
• electrically connecting contacts of at least one electronic device to corresponding ones of the conductive vias.

An electronic package having contacts adapted to be attached to a substrate, said electronic package comprising:

• at least one electronic device, said electronic device having a plurality of contacts thereon;
• a flexible dielectric adhesive interposer including:
• at least one layer of flexible dielectric adhesive having a modulus of elasticity less than about 35,000 kg/cm2,
• a plurality of conductive vias through said layer of flexible dielectric adhesive, said plurality of conductive vias being in a pattern corresponding to a pattern of contacts of one of said electronic device and a substrate, wherein at least certain ones of said plurality of conductive vias correspond to ones of the contacts of said electronic device, and
• a metal foil on one surface of said layer of flexible dielectric adhesive, wherein said metal foil is patterned and is in electrical contact with ones of said conductive vias,
• wherein one of the plurality of conductive vias and the patterned metal foil includes contacts adapted to be attached to a substrate;
• and
• means for connecting the contacts of said electronic device to the certain ones of said conductive vias.

An electronic package for plural electronic devices comprising:

• a plurality of electronic devices, each said electronic device having a pattern of a plurality of contacts thereon;
• a plurality of flexible dielectric adhesive interposers each associated with at least one of said plurality of electronic devices, each including:
• at least one layer of flexible dielectric adhesive having a modulus of elasticity less than about 35,000 kg/cm2,
• a plurality of conductive vias through said layer of flexible dielectric adhesive, said plurality of conductive vias being in a pattern, wherein at least certain ones of said plurality of conductive vias correspond to ones of the contacts of the associated one of said plurality of electronic devices, and
• a metal foil on one surface of said layer of flexible dielectric adhesive, wherein said metal foil is patterned and is in electrical contact with ones of said conductive vias;
• wherein at least one of said plurality of conductive vias and said patterned metal foil includes external contacts adapted for connecting said flexible dielectric adhesive interposer to an external device;
• and
• means for connecting the contacts of each of said plurality of electronic devices to the certain ones of said conductive vias of the flexible dielectric adhesive interposer with which it is associated,
• wherein said plurality of flexible dielectric adhesive interposers are positioned adjacent each other and further comprising:
• means for connecting the external contacts of each of said plurality of flexible dielectric adhesive interposers to the external contacts of an adjacent one of said plurality of flexible dielectric adhesive interposers.

A flexible dielectric adhesive interposer comprising:

• a plurality of layers of flexible dielectric adhesive having a modulus of elasticity less than about 35,000 kg/cm2;
• a plurality of conductive vias through each of said layers of flexible dielectric adhesive, said plurality of conductive vias in each said layer of flexible dielectric adhesive being in a pattern corresponding at least in part to a pattern of said plurality of conductive vias of the adjacent layers of said flexible dielectric adhesive;
• and
• a metal foil between at least two of said layers of flexible dielectric adhesive, wherein said metal foil is patterned and is in electrical contact with ones of said conductive vias of each of the at least two of said layers of flexible dielectric adhesive.

An electronic package for plural electronic devices comprising:

• a plurality of electronic modules, each said electronic module having a predetermined pattern of a plurality of external contacts on first and second opposing surfaces thereof, wherein each said electronic module includes:
• an electronic device having a pattern of contacts thereon;
• a first flexible dielectric adhesive interposer including:
• at least one layer of flexible dielectric adhesive having a modulus of elasticity less than about 35,000 kg/cm2,
• a plurality of conductive vias through said layer of flexible dielectric adhesive, said plurality of conductive vias being in a pattern, wherein at least first ones of said plurality of conductive vias correspond to the contacts of said electronic device, and wherein at least second ones of said plurality of conductive vias correspond to the predetermined pattern of the plurality of external contacts,
• means for electrically connecting corresponding ones of the contacts of said electronic device to corresponding first ones of said plurality of conductive vias;
• and
• a metal foil on one surface of said at least one layer of flexible dielectric adhesive, wherein said metal foil is patterned to provide electrical conductors between corresponding first and second ones of said conductive vias;
• a second dielectric interposer having a central opening therein, wherein said first flexible dielectric adhesive interposer and said second dielectric interposer are adjacent each other with said electronic device disposed in the central opening of said second dielectric interposer, said second dielectric interposer including a plurality of conductive vias in a pattern, wherein at least first ones of said plurality of conductive vias correspond to the predetermined pattern of the plurality of external contacts, and
• means for electrically connecting the second ones of the conductive vias of said first flexible dielectric adhesive interposer to corresponding first ones of the conductive vias of the second dielectric interposer, wherein unconnected ends of the second ones of the conductive vias of said first flexible dielectric adhesive interposer and unconnected ends of the first ones of the conductive vias of the second dielectric interposer provide said external contacts, and
• means for electrically connecting the external contacts on a respective first surface of each of said plurality of electronic modules to the external contacts on the second surface of an adjacent one of said electronic modules, wherein said plurality of electronic modules are positioned adjacent each other and are electrically connected.

A method for making an electronic package for plural electronic devices comprising:

• providing a plurality of electronic devices, each electronic device having a pattern of a plurality of contacts thereon;
• providing a plurality of flexible dielectric adhesive interposers each associated with at least one of the plurality of electronic devices, including:
• providing at least one layer of flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi,
• building up a plurality of conductive vias through the layer of flexible dielectric adhesive, the plurality of conductive vias being built up in a pattern, wherein at least certain ones of the plurality of conductive vias correspond to ones of the contacts of the associated one of the plurality of electronic devices, and
• providing a metal foil on one surface of the layer of flexible dielectric adhesive, and patterning the metal foil in a pattern for being in electrical contact with ones of the conductive vias;
• wherein at least one of the plurality of conductive vias and the patterned metal foil includes external contacts adapted for connecting the flexible dielectric adhesive interposer to an external device;
• and
• connecting the contacts of each of the plurality of electronic devices to the certain ones of the conductive vias of the flexible dielectric adhesive interposer with which it is associated,
• wherein the plurality of flexible dielectric adhesive interposers are positioned adjacent each other and further comprising:
• connecting the external contacts of each of the plurality of flexible dielectric adhesive interposers to the external contacts of an adjacent one of the plurality of flexible dielectric adhesive interposers.