Chip package with heat dissipation plate and manufacturing method thereof

A chip packaging structure having a heat dissipation plate, comprising:

• a substrate, having a first surface and a second surface opposite to each other, wherein the first surface of the substrate is provided with a grounding pin;
• at least one chip, disposed on the first surface of the substrate and electrically connected to the substrate;
• the heat dissipation plate, wherein the heat dissipation plate is a metal cover plate that is bonded to the first surface of the substrate, the heat dissipation plate and the substrate form a cavity in a surrounding manner for holding the chip therein, a thermal interface material is filled between the heat dissipation plate and the chip, the heat dissipation plate is connected to the first surface of the substrate through a conductive connector and electrically connected to the grounding pin, and a connection strength between the conductive connector and the substrate and the heat dissipation plate is greater than a connection strength between the thermal interface material and the chip and the heat dissipation plate;
• a plastic packaging layer, covering the chip, the substrate and the heat dissipation plate, and exposing at least part of a surface region of the heat dissipation plate;
• and
• a metal shielding layer, disposed on a surface of the plastic packaging layer and at least connected to the surface region of the heat dissipation plate exposed by the plastic packaging layer, and electrically connected to the grounding pin through the heat dissipation plate and the conductive connector;
• wherein the heat dissipation plate and the chip are connected by at least one fixed connector, and a connection strength between the fixed connector and the chip or the heat dissipation plate is greater than the connection strength between the thermal interface material and the chip or the heat dissipation plate;
• wherein the heat dissipation plate and the chip are connected by a plurality of fixed connectors, and the fixed connectors are at least distributed at an edge of a non-functional surface of the chip;
• wherein the fixed connectors at least comprise first fixed connectors and second fixed connectors, a connection strength between the first fixed connectors and the chip or the heat dissipation plate is greater than a connection strength between the second fixed connectors and the chip or the heat dissipation plate, the first fixed connectors are distributed at four corners and/or four sides of the non-functional surface of the chip, and the second fixed connectors are distributed in a region between the first fixed connectors on two opposite sides.