H10W 76/157
Having interconnections parallel to the insulating or insulated base
Official title: having interconnections parallel to the insulating or insulated base
H10W76/157 (Having interconnections parallel to the insulating or insulated base) appears on 839 US grants and 531 published applications in this corpus.
Search patents in H10W- Granted patents
- 839
- Published applications
- 531
- Assignees
- 344
- Inventors
- 1,593
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 7 | 0 |
| 1978 | 11 | 0 |
| 1979 | 8 | 0 |
| 1980 | 5 | 0 |
| 1981 | 15 | 0 |
| 1982 | 14 | 0 |
| 1983 | 11 | 0 |
| 1984 | 4 | 0 |
| 1985 | 16 | 0 |
| 1986 | 8 | 0 |
| 1987 | 19 | 0 |
| 1988 | 13 | 0 |
| 1989 | 21 | 0 |
| 1990 | 20 | 0 |
| 1991 | 28 | 0 |
| 1992 | 23 | 0 |
| 1993 | 15 | 0 |
| 1994 | 25 | 0 |
| 1995 | 21 | 0 |
| 1996 | 17 | 0 |
| 1997 | 17 | 0 |
| 1998 | 24 | 0 |
| 1999 | 12 | 0 |
| 2000 | 11 | 0 |
| 2001 | 12 | 4 |
| 2002 | 16 | 18 |
| 2003 | 20 | 10 |
| 2004 | 16 | 21 |
| 2005 | 12 | 11 |
| 2006 | 10 | 15 |
| 2007 | 9 | 14 |
| 2008 | 5 | 16 |
| 2009 | 8 | 13 |
| 2010 | 13 | 9 |
| 2011 | 6 | 10 |
| 2012 | 9 | 19 |
| 2013 | 12 | 19 |
| 2014 | 17 | 21 |
| 2015 | 19 | 20 |
| 2016 | 24 | 35 |
| 2017 | 34 | 32 |
| 2018 | 34 | 28 |
| 2019 | 34 | 28 |
| 2020 | 27 | 32 |
| 2021 | 27 | 31 |
| 2022 | 26 | 30 |
| 2023 | 21 | 39 |
| 2024 | 22 | 16 |
| 2025 | 23 | 23 |
| 2026 | 7 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- IGBT module, motor controller, and vehicle11 Aug 2026US 12,707,662 B2BYD Company Limited
- Semiconductor package and display apparatus including the same4 Aug 2026US 12,702,032 B2Samsung Electronics Co., Ltd.
- Semiconductor apparatus19 May 2026US 12,635,560 B2Fuji Electric Co., Ltd.
- Electronic device package including a gel28 Apr 2026US 12,616,059 B2Microchip Technology Caldicot Limited
- Assembly for a power module, power module and method for producing an assembly for a power module17 Mar 2026US 12,581,993 B2Hitachi Energy Switzerland AG
- Semiconductor device13 Aug 2026US 2026/0240037 A1Fuji Electric Co., Ltd.
- Corrosion resistant power electronic modules30 Jul 2026US 2026/0223709 A1Rockwell Automation Technologies, Inc.
- Power semiconductor module30 Jul 2026US 2026/0223757 A1Dynex Semiconductor Limited
- Semiconductor module and manufacturing method for the same23 Jul 2026US 2026/0215333 A1Fuji Electric Co., Ltd.
- Package16 Jul 2026US 2026/0206599 A1NTT, Inc.
Most cited
By later US patents
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- Encapsulation package and method of packaging an electronic circuit module314US 6,534,711 B1The Goodyear Tire & Rubber Company · 2003
- Semiconductor device with an airtight space formed internally within a hollow package269US 5,343,076 AMitsui Petrochemical Industries, Ltd. · 1994
- Packaging for semiconductor logic devices253US 5,138,434 AMicron Technology, Inc. · 1992
- Pad array carrier IC device using flexible tape207US 5,045,921 AMotorola, Inc. · 1991