IGBT module, motor controller, and vehicle

A motor controller, comprising:

• a liquid-cooling housing, a cooling cavity being defined in the liquid-cooling housing, the liquid-cooling housing comprising a liquid inlet and a liquid outlet in communication with the cooling cavity, and a lead-in hole and a lead-out hole being disposed in two opposite side walls of the cooling cavity, respectively;
• and
• an insulated gate bipolar transistor (IGBT) assembly being inserted into the cooling cavity through the lead-in hole and extended out of the cooling cavity through the lead-out hole, a liquid gap being formed between an inner wall of the cooling cavity and one of two opposite side surfaces of the IGBT assembly in a thickness direction of the IGBT assembly, and two ends of the IGBT assembly being sealed with the liquid-cooling housing to close the lead-in hole and the lead-out hole, wherein
• the IGBT assembly comprises:
• a wafer,
• a first heat dissipation plate and a second heat dissipation plate being disposed on two surfaces of the wafer in a thickness direction of the wafer respectively, a plurality of first heat dissipation pins being disposed at an interval from each other on a surface of the first heat dissipation plate facing away from the second heat dissipation plate, and a plurality of second heat dissipation pins being disposed at an interval from each other on a surface of the second heat dissipation plate facing away from the first heat dissipation plate, and
• an insulating waterproof housing covering a portion of the wafer exposed from the first heat dissipation plate and the second heat dissipation plate.

A vehicle, comprising:

• a motor controller comprising:
• a liquid-cooling housing, a cooling cavity being defined in the liquid-cooling housing, the liquid-cooling housing comprising a liquid inlet and a liquid outlet in communication with the cooling cavity, and a lead-in hole and a lead-out hole being disposed in two opposite side walls of the cooling cavity, respectively;
• and
• an insulated gate bipolar transistor (IGBT) assembly being inserted into the cooling cavity through the lead-in hole and extended out of the cooling cavity through the lead-out hole, a liquid gap being formed between an inner wall of the cooling cavity and one of two opposite side surfaces of the IGBT assembly in a thickness direction of the IGBT assembly, and two ends of the IGBT assembly being sealed with the liquid-cooling housing to close the lead-in hole and the lead-out hole, wherein
• the IGBT assembly comprises:
• a wafer,
• a first heat dissipation plate and a second heat dissipation plate being disposed on two surfaces of the wafer in a thickness direction of the wafer respectively, a plurality of first heat dissipation pins being disposed at an interval from each other on a surface of the first heat dissipation plate facing away from the second heat dissipation plate, and a plurality of second heat dissipation pins being disposed at an interval from each other on a surface of the second heat dissipation plate facing away from the first heat dissipation plate, and
• an insulating waterproof housing covering a portion of the wafer exposed from the first heat dissipation plate and the second heat dissipation plate.