Semiconductor package and display apparatus including the same

A semiconductor package comprising:

• a base film having a first surface and a second surface opposing each other;
• a first conductive structure disposed on the first surface of the base film and including first conductive lines and first conductive patterns extending from the first conductive lines, respectively;
• a semiconductor chip mounted on the first surface of the base film and electrically connected to the first conductive lines;
• a second conductive structure disposed on the second surface of the base film;
• a via passing through the base film and electrically connecting the first conductive structure to the second conductive structure;
• a first conductive layer disposed on the first conductive structure and directly contacting the first conductive patterns;
• and
• a second conductive layer disposed on the second conductive structure and directly contacting at least a portion of the second conductive structure.

A semiconductor package comprising:

• a base film having a first surface on which a semiconductor chip is mounted and a second surface opposite the first surface;
• pads disposed on the first surface of the base film and including at least one ground pad, at least one power pad, and signal pads;
• a first wiring line disposed on the first surface of the base film and including a first end portion electrically connected to the at least one ground pad or the at least one power pad and a second end portion electrically connected to the semiconductor chip;
• a first conductive pattern extending from the first wiring line;
• a first insulating layer covering the first wiring line and exposing the first conductive pattern;
• a first conductive layer disposed on the first insulating layer and covering the semiconductor chip, wherein the first conductive layer directly contacts the first conductive pattern;
• a second conductive pattern disposed on the second surface of the base film and electrically connected to the first conductive pattern;
• and
• a second conductive layer directly contacting the second conductive pattern.