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US 2026/0215333 A1Published application
Semiconductor module and manufacturing method for the same
AssigneeFuji Electric Co., Ltd.
InventorsYuichiro HINATA, Naoyuki KANAI
Life of this patent
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Abstract
A semiconductor module includes a case and a sealing resin. The case includes, on an upper surface thereof, a first region and a second region that is thinner than the first region. A first opening and a recess that annularly surrounds the first opening are formed in the second region. The sealing resin fills the case.
Claims23
A semiconductor module, comprising:
- a case including a first region and a second region on an upper surface thereof, the second region being thinner than the first region and having a first opening and a recess, which annularly surrounds the first opening in a plan view of the semiconductor module, formed therein;
- and
- a sealing resin filling the case.
A manufacturing method for a semiconductor module, comprising:
- preparing
- a case including, on an upper surface thereof, a first region and a second region having a first opening, the second region being thinner than the first region, and including a raised region that is closer to a central axis of the first opening than is a remaining portion of the second region, the raised region surrounding the first opening and rising upward relative to an upper surface of the first region, and
- a component having a second opening formed therein;
- and
- injecting a sealing resin into the case while
- the component is placed in the case with the first opening and the second opening aligned, and
- the upper surface of the case accommodating the component is pressed by a main surface of a mold facing the upper surface of the case so that the raised region is pushed downward.
4 more elements
A manufacturing method for a semiconductor module, comprising:
- preparing
- a case including a first opening in an upper surface thereof,
- a printed board including a second opening,
- an insulated circuit substrate including
- an insulating layer, and
- a conductive pattern layer having a third opening formed therein, and
- a semiconductor element bonded to the conductive pattern layer;
- performing bonding while the case, the printed board accommodated inside the case, and the insulated circuit substrate disposed below the printed board are positioned by inserting a common positioning member into the first opening, the second opening, and the third opening;
- and
- injecting, after removing the positioning member, a sealing resin into the case to seal the printed board and the insulated circuit substrate.
7 more elements
Dependencies are inferred from the claim text.