Encapsulation package and method of packaging an electronic circuit module

Encapsulation package for sequentially potting a circuit module followed by its electrical connections, the package comprising:

• a first base having an inner surface and an outer surface opposite the inner surface;
• the circuit module disposed on the inner surface of the first base, wherein the circuit module requires exercising after being potted;
• a first sidewall extending up from a periphery of the inner surface of the first base such that the first sidewall surrounds the circuit module and is open above the circuit module, thereby defining a first chamber;
• a second base that is separate from the first base;
• a second sidewall extending up from a periphery of the second base and defining a second chamber that is open at its top;
• an inner portion of the first sidewall that is shaped for abutting against an inner portion of the second sidewall;
• a means for joining the first chamber and the second chamber with the inner portion of the first sidewall abutting against the inner portion of the second sidewall;
• elongate conductive elements forming the electrical connections of the circuit module wherein at least a portion of each of the elongate conductive elements has a one end disposed in the first chamber and an opposite end disposed in the second chamber;
• such that the circuit module is connected to the one ends of the at least a portion of the elongate conductive elements, wherein the circuit module's electrical connections can at least be used to exercise the circuit module after potting;
• and
• potting compound wherein the first chamber and the second chamber are separately and sequentially filled with potting compound at different stages of an encapsulation process which includes exercising the circuit module after filling the first chamber but before filling the second chamber.