Semiconductor apparatus
AssigneeFuji Electric Co., Ltd.
InventorHiroki Kogawa
Life of this patent
Estimating the term…
Abstract
A semiconductor apparatus includes: a first semiconductor chip; a resin enclosure having a space in which the first semiconductor chip is positioned; a lead terminal disposed in the resin enclosure; a second semiconductor chip configured to: control the first semiconductor chip, and be disposed on a first portion of the resin enclosure, the resin enclosure not overlapping with the lead terminal, as seen in planar view from a direction perpendicular to a top surface of the lead terminal; and a wire having a first end connected to the lead terminal and a second end connected to the second semiconductor chip.
Claims9
A semiconductor apparatus comprising:
- a first semiconductor chip;
- a resin enclosure having a space in which the first semiconductor chip is positioned;
- a lead terminal disposed in the resin enclosure;
- a second semiconductor chip configured to:
- control the first semiconductor chip, and
- be disposed on a first portion of the resin enclosure, the first portion not overlapping with the lead terminal, as seen in planar view from a direction perpendicular to a top surface of the lead terminal, wherein the second semiconductor chip is bonded to the first portion, wherein a rear surface of the second semiconductor chip is bonded to the first portion with an insulating adhesive;
- and
- a wire having a first end connected to the lead terminal and a second end connected to the second semiconductor chip.
A semiconductor apparatus comprising:
- a first semiconductor chip;
- a resin enclosure having a space in which the first semiconductor chip is positioned;
- a lead terminal disposed in the resin enclosure;
- a second semiconductor chip configured to control the first semiconductor chip;
- and
- a wire having a first end connected to the lead terminal and a second end connected to the second semiconductor chip,
- wherein the lead terminal includes a second top surface recessed from a first top surface to which the wire is connected,
- wherein the resin enclosure includes a first portion provided on the second top surface of the lead terminal, and
- wherein the second semiconductor chip is disposed in the first portion of the resin enclosure, so as to not be in contact with the lead terminal.
Dependencies are inferred from the claim text.