Semiconductor packaging

A semiconductor packaging comprising:

• a substrate on which a semiconductor device is arranged on a front surface;
• a channel member disposed on a rear surface of the substrate and forming a cooling flow path through which a refrigerant moves;
• a porous diamond layer with a first pore size covering an outer surface of the channel member;
• a porous layer with a second pore size stacked on the porous diamond layer and having wettability different from the porous diamond layer;
• a refrigerant inlet and a refrigerant outlet arranged with the channel member in-between, and communicating with the cooling flow path;
• a case in which the channel member is located inside;
• and
• a manifold member disposed on one side of the channel member, the manifold member configured to be in parallel with a direction of movement of the refrigerant and to form a first transfer flow path and a second transfer flow path, the first transfer flow path connecting a refrigerant inlet with the cooling flow path and the second transfer flow path connecting a refrigerant outlet with the cooling flow path;
• wherein one of the porous layer and the porous diamond layer is hydrophilic and an other of the porous layer and the porous diamond layer is hydrophobic;
• wherein the second pore size of the porous layer is different from the first pore size of the porous diamond layer;
• wherein the refrigerant inlet and the refrigerant outlet are formed in the case;
• wherein the first transfer flow path has a first end open to communicate with the refrigerant inlet and a second end closed;
• and
• wherein the second transfer flow path has a first end closed and a second end open to communicate with the refrigerant outlet.