Die attachment film, dicing die bonding film, and semiconductor device manufacturing method
AssigneeResonac Corporation
InventorsYuma ARAI, Kanami NAKAMURA
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Abstract
A die attach film for use in bonding a second semiconductor chip to a plurality of spacers disposed on a substrate around a first semiconductor chip such that the second semiconductor chip overlies the first semiconductor chip while bridging between the plurality of spacers. The die attach film exhibits a minimum melt viscosity of 2,000 Pa·s or more and 9,800 Pa·s or less within a range of 90 to 180° C., and the minimum melt viscosity is a value determined by measuring dynamic viscoelasticity of the die attach film over a range including 90 to 180° C. under conditions of a temperature rising rate of 5° C./min and a frequency of 4 Hz.
Claims10
A die attach film configured to bond a second semiconductor chip to a plurality of spacers disposed on a substrate around a first semiconductor chip such that the second semiconductor chip overlies the first semiconductor chip while bridging between the plurality of spacers,
- wherein the die attach film exhibits a minimum melt viscosity of 2,000 Pa·s or more and 9,800 Pa·s or less within a range of 90 to 180° C., and
- wherein the minimum melt viscosity is a value determined by measuring dynamic viscoelasticity of the die attach film over a range including 90 to 180° C. under conditions of a temperature rising rate of 5° C./min and a frequency of 4 Hz.
A die attach film configured to bond a second semiconductor chip to a plurality of spacers disposed on a substrate around a first semiconductor chip such that the second semiconductor chip overlies the first semiconductor chip while bridging between the plurality of spacers,
- wherein the die attach film comprises a thermosetting component, an elastomer, and an inorganic filler, and
- wherein, based on a mass of the die attach film, a content of the elastomer is 20 mass % or more and 30 mass % or less, and a content of the inorganic filler is 35 mass % or more and 45 mass % or less.
Dependencies are inferred from the claim text.