Semiconductor assembly having a semiconductor element and a substrate

An assembly, comprising:

• a substrate comprising a metallization having a first conductor structure and a second conductor structure, with the first conductor structure being arranged at least partially within the second conductor structure;
• an electronic component connected to the first conductor structure;
• a thermally conductive housing element designed to surround the electronic component and connected with a material bond to the second conductor structure;
• and
• a thermally conductive filler material via which a cover surface and a side surface of the electronic component are connected to the housing element.

A method for producing an assembly with an electronic component and a substrate which comprises a metallization having a first conductor structure and a second conductor structure within which the first conductor structure is at least partially arranged, the method comprising:

• inserting the electronic component and a thermally conductive filler material into a thermally conductive housing element such that a cover surface and a side surface of the electronic component is connected to the housing element via the thermally conductive filler material;
• connecting the electronic component to the first conductor structure of the metallization of the substrate;
• and
• connecting with a material bond the housing element to the second conductor structure of the metallization of the substrate.

A method for producing an assembly with an electronic component and a substrate which comprises a metallization having a first conductor structure and a second conductor structure within which the first conductor structure is at least partially arranged, the method comprising:

• connecting the electronic component to the first conductor structure of the metallization of the substrate;
• connecting with a material bond a thermally conductive housing element to the second conductor structure of the metallization of the substrate;
• and
• filling the thermally conductive housing element with a thermally conductive flowable filler material such that a cover surface and a side surface of the electronic component are connected to the housing element via the thermally conductive flowable filler material.