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US 2026/0293669 A1Published application
Package structure and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPing-Yin Hsieh, Li-Hui Cheng, Pu Wang, Szu-Wei Lu
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Abstract
A package structure includes a first package component including a semiconductor die and a thermal interface material (TIM) structure disposed on a first side of the first package component. The TIM structure includes a dielectric dam, a thermally conductive member surrounded by the dielectric dam and overlapping the semiconductor die, and a conductive layer interposed between the semiconductor die and the thermally conductive member.
Claims20
A package structure, comprising:
- a first package component comprising a semiconductor die;
- and
- a thermal interface material (TIM) structure disposed on a first side of the first package component, the TIM structure comprising:
- a dielectric dam;
- a thermally conductive member surrounded by the dielectric dam and overlapping the semiconductor die;
- and
- a conductive layer interposed between the semiconductor die and the thermally conductive member.
4 more elements
A package structure, comprising:
- a package component comprising a semiconductor die and an insulating encapsulation covering the semiconductor die;
- a TIM structure disposed on the package component and comprising:
- thermally conductive members (430);
- and
- a dielectric dam enclosing the thermally conductive members and separating the thermally conductive members from one another, the dielectric dam covering at least a portion of a sidewall of the insulating encapsulation.
2 more elements
A package structure, comprising:
- a first package component comprising a semiconductor die;
- and
- a TIM structure disposed on the package component, the TIM structure comprising:
- a thermally conductive member;
- and
- a conductive layer interposed between the thermal conductive member and the semiconductor die and lining a sidewall of the thermal conductive member.
3 more elements
Dependencies are inferred from the claim text.