H10W 76/165
Characterised by interconnections through the top surface of the containers
Official title: {characterised by interconnections through the top surface of the containers, e.g. in a metal cap}
H10W76/165 (Characterised by interconnections through the top surface of the containers) appears on 0 US grants and 6 published applications in this corpus.
Search patents in H10W- Granted patents
- 0
- Published applications
- 6
- Assignees
- 3
- Inventors
- 8
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2025 | 0 | 1 |
| 2026 | 0 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
No granted patents in this class yet.
- Semiconductor module arrangement1 Oct 2026US 2026/0305489 A1Infineon Technologies AG
- Semiconductor device and method of manufacturing semiconductor device23 Jul 2026US 2026/0215330 A1Mitsubishi Electric Corporation
- Semiconductor device and method of manufacturing semiconductor device23 Jul 2026US 2026/0215331 A1Fuji Electric Co., Ltd.
- Semiconductor device23 Jul 2026US 2026/0215332 A1Fuji Electric Co., Ltd.
- Semiconductor device and method for manufacturing semiconductor device9 Jul 2026US 2026/0198374 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.