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US 2026/0215332 A1Published application
Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsNaoyuki KANAI, Daisuke Inoue
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Abstract
Provided is a semiconductor device that can prevent resin leakage during transfer molding and prevent poor appearance. The semiconductor device includes: semiconductor chips; a frame surrounding the semiconductor chips and covering the semiconductor chips from above; control terminals electrically connected to the semiconductor chips and projecting from a top surface side of the frame; and a sealing resin provided inside the frame and sealing the semiconductor chips.
Claims14
A semiconductor device, comprising:
- semiconductor chips;
- a frame surrounding the semiconductor chips and covering the semiconductor chips from above;
- control terminals electrically connected to the semiconductor chips and projecting from a top surface side of the frame;
- and
- a sealing resin provided inside the frame and sealing the semiconductor chips,
- wherein the frame includes a cover portion covering the semiconductor chip from above, and
- a bottom surface of the cover portion is in contact with the sealing resin.
4 more elements
Dependencies are inferred from the claim text.