US 2026/0198374 A1Published application

Semiconductor device and method for manufacturing semiconductor device

AssigneeFuji Electric Co., Ltd.

InventorTsubasa NAKAMURA

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Abstract

A semiconductor device, including: a circuit board; a wiring board facing the circuit board with a first gap therebetween, the wiring board having a wiring hole and a guide hole penetrating therethrough; a case; and a sealing member. The case includes: an armor member facing the wiring board with a second gap therebetween, an external connection terminal fixed to the armor member and having a lower end inserted into the wiring hole, a first spacer member protruding from a lower surface of the armor member to be inserted through the guide hole and having a lower end touching the circuit board, and a second spacer member protruding from the lower surface of the armor member having a lower end touching the wiring board. The sealing member fills the first gap and the second gap to thereby seal the wiring board.

Claims13

Dependent claims

A semiconductor device, comprising:

a circuit board;
a wiring board arranged facing an upper surface of the circuit board with a first gap therebetween, the wiring board having a wiring hole and a guide hole penetrating therethrough;
a case, including:
an armor member arranged facing an upper surface of the wiring board with a second gap therebetween,
an external connection terminal fixed to the armor member and having a lower end inserted into the wiring hole of the wiring board to be electrically connected to the wiring hole,
a first spacer member protruding from a lower surface of the armor member to be inserted through the guide hole of the wiring board, the first spacer member having a lower end touching the upper surface of the circuit board to thereby maintain a first distance between the lower surface of the armor member and the upper surface of the circuit board, and
a second spacer member protruding from the lower surface of the armor member, the second spacer member having a lower end touching the upper surface of the wiring board to thereby maintain a second distance between the lower surface of the armor member and the upper surface of the wiring board;
and
a sealing member with which the first gap and the second gap are filled to thereby seal the wiring board.

6 more elements

A semiconductor device manufacturing method, comprising:

preparing
a circuit board,
a wiring board having a wiring hole and a guide hole penetrating therethrough, and
a case, including:
an armor member,
an external connection terminal fixed to the armor member, and having one end protruding from a main surface of the armor member,
a first spacer member protruding from the main surface of the armor member, and
a second spacer member protruding from the main surface of the armor member, and having a length from the main surface shorter than a length of the first spacer member from the main surface;
bringing the wiring board to the armor member from a side of the main surface of the armor member, inserting the first spacer member through the guide hole, inserting one end of the external connection terminal into the wiring hole to electrically connect the wiring hole and the external connection terminal, and bringing an end portion of the second spacer member into contact with the wiring board;
arranging the circuit board to face the wiring board on a side of the wiring board opposite to the armor member, and bringing the circuit board into contact with the first spacer member inserted through the guide hole of the wiring board;
and
filling a first gap between the circuit board and the wiring board and a second gap between the wiring board and the armor member with a sealing member to seal the wiring board.

9 more elements

Dependencies are inferred from the claim text.