H10W 76/17
Characterised by their materials
Official title: characterised by their materials
H10W76/17 (Characterised by their materials) appears on 868 US grants and 972 published applications in this corpus.
Search patents in H10W- Granted patents
- 868
- Published applications
- 972
- Assignees
- 382
- Inventors
- 2,101
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 10 | 0 |
| 2001 | 7 | 3 |
| 2002 | 12 | 18 |
| 2003 | 13 | 13 |
| 2004 | 14 | 12 |
| 2005 | 12 | 20 |
| 2006 | 9 | 20 |
| 2007 | 7 | 18 |
| 2008 | 11 | 16 |
| 2009 | 9 | 12 |
| 2010 | 22 | 13 |
| 2011 | 11 | 24 |
| 2012 | 16 | 28 |
| 2013 | 22 | 27 |
| 2014 | 33 | 37 |
| 2015 | 43 | 63 |
| 2016 | 60 | 85 |
| 2017 | 70 | 79 |
| 2018 | 71 | 71 |
| 2019 | 67 | 63 |
| 2020 | 52 | 48 |
| 2021 | 48 | 50 |
| 2022 | 30 | 51 |
| 2023 | 29 | 55 |
| 2024 | 49 | 50 |
| 2025 | 33 | 54 |
| 2026 | 20 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Integrated curcuit to dielectric substrate transition25 Aug 2026US 12,721,171 B2Analog Devices International Unlimited Company
- Semiconductor device25 Aug 2026US 12,721,188 B2Fuji Electric Co., Ltd.
- Optoelectronic semiconductor component, optoelectronic device, and method for producing an optoelectronic semiconductor component and/or optoelectronic device11 Aug 2026US 12,707,771 B2ams-OSRAM International GmbH
- Composite component and method for manufacturing the same7 Jul 2026US 12,677,680 B2Murata Manufacturing Co., Ltd.
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- Component package and method for the production thereof1 Oct 2026US 2026/0305460 A1ams-OSRAM International GmbH
- Semiconductor package and a method for forming the same17 Sep 2026US 2026/0282932 A1JCET STATS ChipPAC Korea Limited
- Semiconductor assembly having a warpage inhibitor in combination with a sealant27 Aug 2026US 2026/0255976 A1Bridge Semiconductor Corporation
- Housing for an electronic component, assembly having a housing, and method for producing a housing20 Aug 2026US 2026/0247572 A1Lisa Draexlmaier GmbH
- Semiconductor device20 Aug 2026US 2026/0248030 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Bi-level microelectronic device package with an integral window296US 6,674,159 B1Sandia National Laboratories · 2004
- Microelectronic device package with an integral window238US 6,384,473 B1Sandia Corporation · 2002
- Single level microelectronic device package with an integral window236US 6,661,084 B1Sandia Corporation · 2003
- Packaging means for a semiconductor die having particular shelf structure194US 5,107,328 AMicron Technology, Inc. · 1992
- Method of processing a substrate175US 7,329,608 B2The Regents of the University of California · 2008