Composite component and method for manufacturing the same

Abstract

A composite component includes an interposer structure and an electronic component. The interposer structure has a Si base layer having a first main surface and a second main surface opposite to each other, a redistribution layer formed on the first main surface, through-Si vias electrically connected to the redistribution layer and penetrating the Si base layer, an interposer electrode facing the second main surface, an adhesive layer and an insulating layer. The electronic component has component electrodes respectively connected to the through-Si vias. The electronic component is provided between the interposer electrode and the Si base layer. The insulating layer is disposed between the component electrodes of the electronic component. In the electronic component, the component electrode and a surface on which the insulating layer is disposed are bonded to the second main surface of the Si base layer with the adhesive layer interposed therebetween.

Dependencies are inferred from the claim text.