Semiconductor device

A semiconductor device comprising:

• an insulating substrate;
• a frame body surrounding the insulating substrate;
• a first semiconductor chip including a first upper electrode, a first lower electrode, and a first semiconductor layer provided between the first upper electrode and the first lower electrode, the first semiconductor chip being provided on the insulating substrate;
• a first electrode terminal including a first flat plate portion and electrically connected to one of the first upper electrode and the first lower electrode;
• a second electrode terminal including a second flat plate portion facing the first flat plate portion and electrically connected to the other of the first upper electrode and the first lower electrode;
• a first resin member fixed to at least one of the first electrode terminal and the second electrode terminal and including a fitting portion fitted into the frame body, the fitting portion containing a first resin having a first volume resistivity and a first Young's modulus;
• and
• a second resin member provided between the first flat plate portion and the second flat plate portion and containing a second resin having a second volume resistivity greater than the first volume resistivity and a second Young's modulus greater than the first Young's modulus.