Bi-level microelectronic device package with an integral window

A package with an integral window for housing a microelectronic device, comprising:

• a monolithic body, comprising a electrically insulating multilayered material;
• the body having a bottom surface, an opposing top surface, a stepped aperture disposed through the body, and at least two interior ledges;
• a first electrical conductor disposed on the first interior ledge;
• a second electrical conductor disposed on the second interior ledge;
• an integral window disposed across the aperture and bonded directly to the body without having a separate layer of adhesive material disposed in-between the window and the body;
• and
• a first microelectronic device flip-chip interconnected to the first electrical conductor on the first interior ledge.

A package with an integral window for housing a microelectronic device, comprising:

• a monolithic body, comprising a electrically insulating multilayered material;
• the body having a bottom surface, an opposing top surface, a stepped aperture disposed through the body, and at least two interior ledges;
• a first electrical conductor disposed on the first interior ledge;
• a second electrical conductor disposed on the second interior ledge;
• an integral window disposed across the aperture and bonded directly to the body without having a separate layer of adhesive material disposed in-between the window and the body;
• and
• a first microelectronic device flip-chip interconnected to the first electrical conductor on the first interior ledge;
• and
• further comprising a cover lid attached to the top surface of the body for sealing the package;
• wherein the cover lid is transparent.

A package with an integral window for housing a microelectronic device, comprising:

• a monolithic body, comprising a electrically insulating multilayered material;
• the body having a bottom surface, an opposing top surface, a steered aperture disposed through the body, and at least two interior ledges;
• a first electrical conductor disposed on the first interior ledge;
• a second electrical conductor disposed on the second interior ledge;
• an integral window disposed across the aperture and bonded directly to the body without having a separate layer of adhesive material disposed in-between the window and the body;
• and
• a first microelectronic device flip-chip interconnected to the first electrical conductor on the first interior ledge;
• and
• further comprising a cover lid attached to the top surface of the body for sealing the package;
• wherein the cover lid comprises a window.

A package with an integral window for housing a microelectronic device, comprising:

• a monolithic body, comprising a electrically insulating multilayered material;
• the body having a bottom surface, an opposing top surface, a stepped aperture disposed through the body, and at least two interior ledges;
• a first electrical conductor disposed on the first interior ledge;
• a second electrical conductor disposed on the second interior ledge;
• an integral window disposed across the aperture and bonded directly to the body without having a separate layer of adhesive material disposed in-between the window and the body;
• and
• a first microelectronic device flip-chip interconnected to the first electrical conductor on the first interior ledge;
• wherein the first microelectronic device comprises a light-sensitive side facing the window;
• wherein the package is mounted on, and is electrically interconnected to, a printed wiring board;
• wherein the printed wiring board comprises an opening through the board;
• and
• wherein the aperture in the package is aligned with the opening in the printed wiring board, thereby allowing light to pass through both the opening and the aperture to interact with the light-sensitive side of the first microelectronic device.