Housing for an electronic component, assembly having a housing, and method for producing a housing
AssigneeLisa Draexlmaier GmbH
InventorMichael WORTBERG
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Abstract
A housing for accommodating an electronic component having a housing wall and a cooling element is provided. The cooling element is an integral part with the housing wall, and the cooling element and the housing wall may be obtained by a multicomponent injection molding process. The cooling element is arranged in such a way that heat created in the electronic component may be transported by the cooling element to the housing wall, and the cooling element is arranged in such a way that the electronic component may be in surface-to-surface contact with the cooling element.
Claims13
A housing for accommodating an electronic component, comprising:
- a housing wall;
- and
- a cooling element that is an integral part with the housing wall, the cooling element and the housing wall formed by a multicomponent injection molding process, and the cooling element is configured so that heat created in the electronic component is transported by the cooling element to the housing wall, and the electronic component is in surface-to-surface contact with the cooling element.
A method for producing a housing for accommodating an electronic component, comprising:
- providing a first material for producing a housing wall;
- providing a second material for producing a cooling element;
- and
- producing the housing wall with the cooling element integrally bonded to the housing wall by a multicomponent injection molding process.
Dependencies are inferred from the claim text.