Semiconductor package and a method for forming the same

A method for making a semiconductor package, the method comprising:

• providing a substrate strip comprising a plurality of substrate units and a plurality of saw regions each located between two adjacent substrate units;
• mounting at least one electronic component on a front surface of each substrate unit;
• attaching a plurality of metal caps onto the substrate strip to cover the front surfaces of the plurality of substrate units respectively but expose the plurality of saw regions, wherein each of the plurality of metal caps defines a cavity to accommodate the at least one electronic component on the corresponding substrate unit and has a supporting component at a bottom surface of the metal cap to create a gap between the metal cap and the corresponding substrate unit;
• applying a molding material on the substrate strip to form a molding layer encapsulating the metal caps and the substrate strip, wherein the molding material flows into the cavities of the plurality of metal caps through the respective gaps to form respective mold caps;
• removing the saw regions of the substrate strip and a portion of the molding layer on the saw regions to form a groove and a mold linkage between each two adjacent substrate units, wherein the groove exposes lateral surfaces of the two substrate units adjacent thereto and a portion of lateral surfaces of two metal caps on the two adjacent substrate units;
• forming a shielding layer at least on the lateral surfaces of the substrate units and the exposed lateral surfaces of the metal caps;
• and
• removing the mold linkages to separate the plurality of substrate units into a plurality of substrates, such that each of the plurality of substrates, together with the at least one electronic component mounted thereon, one of the mold caps encapsulating the at least one electronic component and one of the metal caps covering the substrate, form a semiconductor package.