Semiconductor assembly having a warpage inhibitor in combination with a sealant
AssigneeBridge Semiconductor Corporation
InventorsCharles W. C. LIN, Chia-Chung WANG
Life of this patent
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Abstract
A semiconductor assembly includes a warpage inhibitor, a semiconductor device, a sealant, and a wiring structure. The semiconductor device is electrically connected to the wiring structure and embedded in the sealant, which is combined with the warpage inhibitor to form a rigid-compliant reinforced composite configuration. The warpage inhibitor contains inorganic materials that have a suitably low coefficient of thermal expansion (CTE) and a suitably high elastic modulus to provide rigidity and reduce CTE-induced warpage between the sealant and a carrier by limiting the volume of sealant that has a CTE mismatch with the carrier.
Claims16
A semiconductor assembly, comprising a warpage inhibitor, a semiconductor device, a sealant and a wiring structure, wherein:
- the warpage inhibitor includes a supporting frame configured with at least one inner periphery and contains an inorganic material with elastic modulus higher than 60 GPa and a coefficient of thermal expansion lower than 10 ppm/° C.;
- the semiconductor device is disposed in a compartment laterally surrounded by the at least one inner periphery of the supporting frame and has contact pads;
- the sealant fills into the compartment and laterally surrounds the semiconductor device and coats the at least one inner periphery of the supporting frame;
- and
- the wiring structure includes conductive traces that extend laterally below a bottom side of the semiconductor device and are electrically connected to the contact pads of the semiconductor device.
Dependencies are inferred from the claim text.