H10W 76/18
Insulating materials
Official title: Insulating materials, e.g. resins, glasses or ceramics
H10W76/18 (Insulating materials) appears on 322 US grants and 362 published applications in this corpus.
Search patents in H10W- Granted patents
- 322
- Published applications
- 362
- Assignees
- 193
- Inventors
- 845
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 1 |
| 2002 | 5 | 4 |
| 2003 | 8 | 7 |
| 2004 | 4 | 2 |
| 2005 | 2 | 6 |
| 2006 | 2 | 4 |
| 2007 | 1 | 6 |
| 2008 | 2 | 5 |
| 2009 | 3 | 1 |
| 2010 | 5 | 4 |
| 2011 | 0 | 4 |
| 2012 | 4 | 5 |
| 2013 | 9 | 15 |
| 2014 | 10 | 10 |
| 2015 | 11 | 20 |
| 2016 | 17 | 23 |
| 2017 | 25 | 36 |
| 2018 | 30 | 30 |
| 2019 | 26 | 30 |
| 2020 | 20 | 18 |
| 2021 | 23 | 26 |
| 2022 | 19 | 20 |
| 2023 | 10 | 18 |
| 2024 | 18 | 20 |
| 2025 | 9 | 26 |
| 2026 | 5 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optoelectronic semiconductor component, optoelectronic device, and method for producing an optoelectronic semiconductor component and/or optoelectronic device11 Aug 2026US 12,707,771 B2ams-OSRAM International GmbH
- Polychlorotrifluoroethylene (PCTFE) polymer enclosure for an implantable device9 Jun 2026US 12,653,064 B2Neuralink Corp.
- Method for producing hollow package and method for providing photosensitive composition19 May 2026US 12,631,963 B2Tokyo Ohka Kogyo.Co., Ltd.
- QFN packaging structure and QFN packaging method10 Mar 2026US 12,575,447 B2Jcet Group Co., Ltd.
- Semiconductor package with gas release holes17 Feb 2026US 12,557,694 B2Stmicroelectronics Pte Ltd
- Component package and method for the production thereof1 Oct 2026US 2026/0305460 A1ams-OSRAM International GmbH
- Semiconductor assembly having a warpage inhibitor in combination with a sealant27 Aug 2026US 2026/0255976 A1Bridge Semiconductor Corporation
- Semiconductor device20 Aug 2026US 2026/0248030 A1Kabushiki Kaisha Toshiba
- Heat dissipation structure for semiconductor package module and electronic device including the same23 Jul 2026US 2026/0215275 A1Unick Corporation
- Multistage sealed power-electronic module23 Jul 2026US 2026/0215334 A1
Most cited
By later US patents
- Bi-level microelectronic device package with an integral window296US 6,674,159 B1Sandia National Laboratories · 2004
- Microelectronic device package with an integral window238US 6,384,473 B1Sandia Corporation · 2002
- Single level microelectronic device package with an integral window236US 6,661,084 B1Sandia Corporation · 2003
- Packaging means for a semiconductor die having particular shelf structure194US 5,107,328 AMicron Technology, Inc. · 1992
- Method of processing a substrate175US 7,329,608 B2The Regents of the University of California · 2008