Multistage sealed power-electronic module
OwnerJean-Christophe RIOU, Nawres SRIDI-CONVERSinventors
Life of this patent
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Abstract
A power-electronic module includes a substrate; a first power-electronic component arranged on a first face of the substrate; a first cover which defines, together with the substrate, a first cavity in which the first power-electronic component is housed; a second power-electronic component arranged on a second face of the substrate; and a second cover which defines, together with the substrate, a second cavity in which the second power-electronic component is housed; a first ring seal which seals the first cavity; a second ring seal which seals the second cavity; wherein the first and second ring seals are formed from a sintered material and wherein the first and second cavities hold a gas or a mixture of gases.
Claims13
An electronic power module comprising:
- a substrate having a first face and a second face opposite to the first face;
- a first electronic power component disposed on the first face of the substrate
- a first cap disposed on the first face of the substrate and delimiting together with the substrate a first cavity in which the first electronic power component is housed;
- a second electronic power component disposed on the second face of the substrate and
- a second cap disposed on the second face of the substrate and delimiting together with the substrate a second cavity in which the second electronic power component is housed;
- a first annular seal disposed between the substrate and the first cap, the first annular seal sealingly closing the first cavity
- a second annular seal disposed between the substrate and the second cap the second annular seal sealingly closing the second cavity wherein the first and second annular seals are formed of a sintered material, and wherein the first and second cavities enclose a gas or a gas mixture.
A method for manufacturing an electronic module comprising:
- providing a substrate a first cap and a second cap
- attaching a first electronic power component to the first cap
- depositing a sintering material onto the first cap so as to form a first bead around the first electronic power component
- attaching a second electronic power component to the second cap
- depositing the sintering material onto the second cap so as to form a second bead around the second electronic power component
- transferring the first cap to a first face of the substrate and the second cap to a second opposite face of the substrate, by disposing the first and second beads of sintering material in contact with the substrate;
- and
- sintering the sintering material to form first and second annular seals the first annular seal sealingly closing a first cavity delimited by the first cap and the substrate and the second annular seal sealingly closing a second cavity delimited by the second cap and the substrate the first and second cavities enclosing a gas or gas mixture.
Dependencies are inferred from the claim text.