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US 12,575,447 B2Granted
QFN packaging structure and QFN packaging method
AssigneeJcet Group Co., Ltd.
InventorsYun Gao, Ting Liu, Yuesheng Zhang, Rong Fan
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Abstract
The present invention provides a QFN packaging structure and QFN packaging method. By providing the insulating layer on the outer side of the leads of the QFN packaging structure, a short circuit between the leads and the electromagnetic shielding layer can be prevented. In addition, the grounding lead is exposed from the insulating layer, such that the electromagnetic shielding layer is grounded via the grounding lead, thereby realizing the electromagnetic shielding design of the QFN packaging structure.
Claims6
A QFN packaging structure, comprising:
- a package frame, a chip and a plastic package layer, wherein the package frame comprises at least one base island, and leads distributed on at least one side of the base island;
- the chip is provided on the base island and electrically connected to the leads;
- and the plastic package layer covers the package frame and the chip, and side surfaces and a bottom surface of the leads are exposed to the plastic package layer;
- wherein
- the QFN packaging structure further comprises an insulating layer and an electromagnetic shielding layer, wherein the leads include a grounding lead;
- the electromagnetic shielding layer covers side surfaces and a top surface of the plastic package layer;
- the insulating layer is provided at least between the electromagnetic shielding layer and the leads, and the grounding lead is exposed from the insulating layer;
- the insulating layer has a notch directly at the grounding lead;
- and the electromagnetic shielding layer is grounded via the grounding lead,
- wherein the insulating layer covers the side surfaces and the top surface of the plastic package layer, and the electromagnetic shielding layer is provided on the insulating layer to cover side surfaces and a top surface of the QFN packaging structure.
7 more elements
A QFN packaging method, comprising:
- providing a chip and a package frame that comprises a base island and leads distributed on at least one side of the base island, placing the chip on the base island, and electrically connecting the chip to the leads, wherein the leads include a grounding lead;
- plastic-packaging the package frame and the chip to form a plastic package layer covering the package frame and the chip;
- cutting to acquire a single QFN packaging structure;
- forming an occlusion at a side edge of the grounding lead;
- forming an insulating layer at least on side surfaces of the QFN packaging structure;
- peeling off the occlusion to expose the grounding lead from the insulating layer;
- forming an electromagnetic shielding layer on the side surfaces and the top surface of the QFN packaging structure;
- forming the insulating layer on the side surfaces and the top surface of the QFN packaging structure, and forming the electromagnetic shielding layer on side surfaces and a top surface of the insulating layer;
- and
- forming an electrical connection between the electromagnetic shielding layer and the grounding lead.
7 more elements
Dependencies are inferred from the claim text.