Semiconductor package with gas release holes
AssigneesSTMicroelectronics S.r.l., Stmicroelectronics Pte Ltd
InventorsDavid Gani, Hui-Tzu Wang
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a silicon substrate with an active surface and an inactive surface. A semiconductor device, such as an image, light, or optical sensor, is formed in the active surface and disposed on the substrate. A glass plate is coupled to the substrate with adhesive. The glass plate includes a sensor area that corresponds to the area of the semiconductor device and holes through the glass plate that are generally positioned around the sensor area of the glass plate. During formation of the package, the holes through the glass plate allow gas released by the adhesive to escape the package and prevent formation of a gas bubble.
Claims20
A device, comprising:
- a substrate;
- a semiconductor device on the substrate;
- a glass plate on the substrate, the glass plate having a first surface, a second surface opposite to the first surface, and a sensor area corresponding to the semiconductor device;
- an adhesive between the semiconductor device and the glass plate;
- and
- a plurality of holes through the glass plate from the first surface to the second surface that each expose a top surface of the adhesive, the plurality of holes arranged around at least a portion of the sensor area of the glass plate.
A device, comprising:
- a semiconductor device;
- a glass plate on the semiconductor device having a sensor area;
- an adhesive between the semiconductor device and the glass plate;
- and
- a plurality of holes only through the glass plate proximate the sensor area of the glass plate, wherein the plurality of holes each expose a top surface of the adhesive.
A device, comprising:
- a substrate;
- a semiconductor device on the substrate, the semiconductor device having a first side and a second side opposite to the first side;
- a glass plate on the semiconductor device;
- an adhesive between the semiconductor device and the glass plate;
- and
- a plurality of holes through the glass plate, the plurality of holes aligned proximate the first side and the second side of the semiconductor device, wherein the plurality of holes each expose a top surface of the adhesive.
Dependencies are inferred from the claim text.