Semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Chien Pan, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
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Abstract
A semiconductor device includes a package substrate, a package component, a heat dissipation component and a plurality of first adhesive patterns. The package component is bonded to the package substrate. The first adhesive patterns are adhered to and disposed between the package substrate and the heat dissipation component, the first adhesive patterns are disposed at a first side of the package component, and at least two of the first adhesive patterns are physically separated from each other and substantially aligned with each other in a first direction along which the first side is extended.
Claims20
A semiconductor device, comprising:
- a package substrate;
- a package component, bonded to the package substrate;
- a heat dissipation component;
- and
- a plurality of first adhesive patterns, wherein the first adhesive patterns are adhered to and disposed between the package substrate and the heat dissipation component, the first adhesive patterns are disposed at a first side of the package component, and at least two of the first adhesive patterns are physically separated from each other and substantially aligned with each other in a first direction along which the first side is extended.
A semiconductor device, comprising:
- a package substrate;
- a package component having a first side;
- a plurality of first adhesive patterns, disposed at the first side of the package component, wherein a distance between one of the first adhesive patterns and the first side of the package component is substantially equal to a distance between another of the first adhesive patterns and the first side of the package component.
A semiconductor device, comprising:
- a package substrate;
- a package component, bonded to the package substrate;
- and
- a plurality of first adhesive patterns, wherein the first adhesive patterns are arranged along a first side of the package component, and at least two of the first adhesive patterns are physically separated from each other and substantially aligned with each other in a first direction along which the first side is extended.
Dependencies are inferred from the claim text.