H10W 76/40
Fillings or auxiliary members in containers
Official title: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
H10W76/40 (Fillings or auxiliary members in containers) appears on 3,309 US grants and 3,757 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,309
- Published applications
- 3,757
- Assignees
- 778
- Inventors
- 6,647
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 6 | 0 |
| 1979 | 4 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 7 | 0 |
| 1985 | 9 | 0 |
| 1986 | 7 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 8 | 0 |
| 1990 | 6 | 0 |
| 1991 | 10 | 0 |
| 1992 | 16 | 0 |
| 1993 | 17 | 0 |
| 1994 | 19 | 0 |
| 1995 | 27 | 0 |
| 1996 | 23 | 0 |
| 1997 | 31 | 0 |
| 1998 | 50 | 0 |
| 1999 | 76 | 0 |
| 2000 | 77 | 0 |
| 2001 | 58 | 31 |
| 2002 | 71 | 98 |
| 2003 | 61 | 69 |
| 2004 | 78 | 93 |
| 2005 | 70 | 109 |
| 2006 | 66 | 102 |
| 2007 | 53 | 82 |
| 2008 | 56 | 77 |
| 2009 | 59 | 91 |
| 2010 | 69 | 91 |
| 2011 | 78 | 85 |
| 2012 | 72 | 88 |
| 2013 | 80 | 110 |
| 2014 | 82 | 114 |
| 2015 | 132 | 131 |
| 2016 | 126 | 165 |
| 2017 | 137 | 151 |
| 2018 | 146 | 172 |
| 2019 | 177 | 215 |
| 2020 | 180 | 236 |
| 2021 | 158 | 268 |
| 2022 | 192 | 268 |
| 2023 | 216 | 296 |
| 2024 | 185 | 262 |
| 2025 | 169 | 229 |
| 2026 | 111 | 124 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Dam surrounding a die on a substrate22 Sep 2026US 12,745,668 B2Intel Corporation
- Encapsulation techniques22 Sep 2026US 12,745,670 B2Elta Systems Ltd.
- Fine bump pitch die to die tiling incorporating an inverted glass interposer1 Sep 2026US 12,727,490 B2Intel Corporation
- Method for processing a semiconductor wafer and semiconductor composite structure18 Aug 2026US 12,713,926 B2Infineon Technologies AG
- Semiconductor module18 Aug 2026US 12,713,941 B2Fuji Electric Co., Ltd.
- System-in-package (sip) configured to receive multiple memory dies8 Oct 2026US 2026/0314443 A1QUALCOMM Incorporated
- Integrated circuit (ic) package having a package mold layer and a stiffener in the package mold layer to reduce warpage17 Sep 2026US 2026/0283009 A1QUALCOMM Incorporated
- Semiconductor assembly having a semiconductor element and a substrate10 Sep 2026US 2026/0271723 A1Siemens Aktiengesellschaft
- Semiconductor device10 Sep 2026US 2026/0271779 A1Kabushiki Kaisha Toshiba
- Integrated circuit device packages with buffering layer3 Sep 2026US 2026/0262518 A1Avago Technologies International Sales Pte. Limited
Most cited
By later US patents
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby412US 6,423,570 B1Intel Corporation · 2002
- Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby382US 6,902,950 B2Intel Corporation · 2005
- Semiconductor package and method thereof328US 5,776,798 AMotorola, Inc. · 1998