H10W 76/42
Fillings
H10W76/42 (Fillings) appears on 1,981 US grants and 2,147 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,981
- Published applications
- 2,147
- Assignees
- 617
- Inventors
- 4,166
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 8 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 7 | 0 |
| 1990 | 5 | 0 |
| 1991 | 9 | 0 |
| 1992 | 10 | 0 |
| 1993 | 12 | 0 |
| 1994 | 14 | 0 |
| 1995 | 22 | 0 |
| 1996 | 18 | 0 |
| 1997 | 25 | 0 |
| 1998 | 39 | 0 |
| 1999 | 55 | 0 |
| 2000 | 59 | 0 |
| 2001 | 43 | 25 |
| 2002 | 47 | 56 |
| 2003 | 42 | 40 |
| 2004 | 46 | 58 |
| 2005 | 40 | 66 |
| 2006 | 43 | 75 |
| 2007 | 38 | 58 |
| 2008 | 35 | 47 |
| 2009 | 41 | 47 |
| 2010 | 44 | 55 |
| 2011 | 37 | 49 |
| 2012 | 39 | 60 |
| 2013 | 48 | 77 |
| 2014 | 43 | 73 |
| 2015 | 91 | 84 |
| 2016 | 89 | 109 |
| 2017 | 87 | 96 |
| 2018 | 92 | 98 |
| 2019 | 105 | 126 |
| 2020 | 104 | 112 |
| 2021 | 82 | 139 |
| 2022 | 93 | 126 |
| 2023 | 94 | 146 |
| 2024 | 89 | 129 |
| 2025 | 81 | 118 |
| 2026 | 65 | 78 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Dam surrounding a die on a substrate22 Sep 2026US 12,745,668 B2Intel Corporation
- Encapsulation techniques22 Sep 2026US 12,745,670 B2Elta Systems Ltd.
- Fine bump pitch die to die tiling incorporating an inverted glass interposer1 Sep 2026US 12,727,490 B2Intel Corporation
- Semiconductor module18 Aug 2026US 12,713,941 B2Fuji Electric Co., Ltd.
- Semiconductor devices and methods of manufacturing semiconductor devices18 Aug 2026US 12,713,969 B2Amkor Technology Singapore Holding Pte.Ltd.
- Integrated circuit (ic) package having a package mold layer and a stiffener in the package mold layer to reduce warpage17 Sep 2026US 2026/0283009 A1QUALCOMM Incorporated
- Semiconductor assembly having a semiconductor element and a substrate10 Sep 2026US 2026/0271723 A1Siemens Aktiengesellschaft
- Integrated circuit device packages with buffering layer3 Sep 2026US 2026/0262518 A1Avago Technologies International Sales Pte. Limited
- Embedded cooling systems for advanced device packaging27 Aug 2026US 2026/0255962 A1Adeia Semiconductor Bonding Technologies Inc.
- Structure and method for embedding a plurality of devices and components into a substrate core27 Aug 2026US 2026/0256017 A1Advanced Micro Devices, Inc.
Most cited
By later US patents
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Semiconductor package and method thereof328US 5,776,798 AMotorola, Inc. · 1998
- Method of making a cavity ball grid array apparatus317US 6,326,244 B1Micron Technology, Inc. · 2001
- Encapsulation package and method of packaging an electronic circuit module314US 6,534,711 B1The Goodyear Tire & Rubber Company · 2003