H10W 76/48
Fillings including materials for absorbing or reacting with moisture or other undesired
Official title: Fillings including materials for absorbing or reacting with moisture or other undesired substances
H10W76/48 (Fillings including materials for absorbing or reacting with moisture or other undesired) appears on 320 US grants and 364 published applications in this corpus.
Search patents in H10W- Granted patents
- 320
- Published applications
- 364
- Assignees
- 203
- Inventors
- 816
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 4 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 3 |
| 2002 | 6 | 14 |
| 2003 | 12 | 17 |
| 2004 | 13 | 16 |
| 2005 | 8 | 19 |
| 2006 | 7 | 23 |
| 2007 | 8 | 15 |
| 2008 | 11 | 17 |
| 2009 | 13 | 14 |
| 2010 | 16 | 14 |
| 2011 | 12 | 14 |
| 2012 | 10 | 15 |
| 2013 | 9 | 13 |
| 2014 | 15 | 13 |
| 2015 | 16 | 16 |
| 2016 | 21 | 23 |
| 2017 | 20 | 18 |
| 2018 | 17 | 12 |
| 2019 | 10 | 13 |
| 2020 | 14 | 11 |
| 2021 | 7 | 15 |
| 2022 | 13 | 6 |
| 2023 | 8 | 12 |
| 2024 | 7 | 15 |
| 2025 | 6 | 11 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Corrosive gas scavenging component for a power semiconductor component18 Aug 2026US 12,713,971 B1Meta Platforms, Inc.
- Method of manufacturing a sensor device7 Jul 2026US 12,677,483 B2Melexis Technologies SA
- Semiconductor module5 May 2026US 12,622,315 B2Fuji Electric Co., Ltd.
- Getter activation and use7 Apr 2026US 12,594,541 B2Johnson Matthey Davy Technologies Limited
- Package structure and method for manufacturing the same17 Feb 2026US 12,552,662 B2Murata Manufacturing Co., Ltd.
- Corrosion resistant power electronic modules30 Jul 2026US 2026/0223709 A1Rockwell Automation Technologies, Inc.
- Micro-electro-mechanical system package and fabrication method thereof9 Jul 2026US 2026/0193079 A1Vanguard International Semiconductor Corporation
- Angled stiffener with directive flow assist structure for glue dispense25 Jun 2026US 2026/0182446 A1Intel Corporation
- Semiconductor device21 May 2026US 2026/0144139 A1Fuji Electric Co., Ltd.
- Semiconductor device with moisture diffusive through glass via structure26 Mar 2026US 2026/0090463 A1International Business Machines Corporation
Most cited
By later US patents
- Method of processing a substrate175US 7,329,608 B2The Regents of the University of California · 2008
- Electrochemical solid phase synthesis146US 6,093,302 ACombiMatrix Corporation · 2000
- Package for a semiconductor device131US 5,293,511 ATexas Instruments Incorporated · 1994
- Enclosure for electronic devices112US 5,244,707 A1993
- Flexible electronic devices and related methods107US 8,525,340 B2Premitec, Inc. · 2013