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US 12,622,315 B2Granted
Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorAkira Morozumi
Life of this patent
Estimating the term…
Abstract
A semiconductor module includes: a mounting substrate including a mounting surface; a semiconductor element disposed on the mounting surface; a housing for the semiconductor element; a lid fixed to the housing and facing the mounting surface; an insulating sealing material disposed in a space inside the housing and sealing the semiconductor element; and a first adsorbent disposed between the lid and the insulating sealing material and is swollen by adsorption.
Claims16
A semiconductor module comprising:
- a housing surrounding a space in the housing;
- a mounting substrate in the space, and including a mounting surface;
- a semiconductor element in the space, and on the mounting surface;
- a lid faced toward the mounting surface, and fixed to the housing such that the space is closed by the lid;
- an insulating sealing material in the space, and sealing the semiconductor element;
- and
- an adsorbent in the space, and between the lid and the insulating sealing material, the adsorbent configured to swell by adsorption such that, with the adsorbent swollen by adsorption, the adsorbent presses the insulating sealing material to thereby prevent formation of a gap between the mounting substrate and the insulating sealing material.
4 more elements
A semiconductor module, comprising:
- a housing surrounding a space in the housing;
- a mounting substrate in the space, and including a mounting surface;
- a semiconductor element in the space, and on the mounting surface;
- a lid faced toward the mounting surface, and fixed to the housing such that the space is closed by the lid;
- an insulating sealing material in the space, and sealing the semiconductor element;
- and
- an adsorbent accommodated in an accommodating portion in an inner wall surface of the housing that faces the space, and
- a protective film that covers:
- the inner wall surface of the housing, and
- a surface of the insulating sealing material that faces the space,
- wherein the adsorbent is configured to adsorb a penetrating substance such that, with the penetrating substance entered in a gap between the protective film and the inner wall surface, adhesion of the penetrating substance to the insulating sealing material is suppressed by the adsorbent.
8 more elements
A semiconductor module, comprising:
- a housing surrounding a space in the housing;
- a mounting substrate in the space, and including a mounting surface;
- a semiconductor element in the space, and on the mounting surface;
- a lid faced toward the mounting surface, and fixed to the housing such that the space is closed by the lid;
- an insulating sealing material in the space, and sealing the semiconductor element;
- and
- at least one wiring member electrically connected to the semiconductor element, and including:
- a coupling portion embedded in the housing, and
- an external terminal extended from an external surface of the housing to an outside of the housing;
- and
- a protector joined to the external surface and the external terminal such that a gap between the external surface and the external terminal is covered by the protector, the protector being a single component.
8 more elements
Dependencies are inferred from the claim text.