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US 12,713,971 B1Granted
Corrosive gas scavenging component for a power semiconductor component
AssigneeMeta Platforms, Inc.
InventorHoward Lee Davidson
Life of this patent
Estimating the term…
Abstract
An improved power module is disclosed. The power module comprises a power semiconductor component. The power module comprises an encasing configured to at least in part encase the power semiconductor component. The power module comprises a corrosive gas scavenging component placed within the encasing and configured to reduce corrosion of metal included in the power semiconductor component by having a material reactive to one or more corrosive gases to consume at least a portion of the one or more corrosive gases within the encasing.
Claims19
A device, comprising:
- a power semiconductor component;
- an encasing configured to at least in part encase the power semiconductor component, the encasing including a baseplate configured to support the power semiconductor component, walls surrounding the baseplate, and a top cover, wherein the walls are separable from the baseplate;
- and
- a corrosive gas scavenging component that is attached to an interior surface of the top cover, is encased by the encasing, and is configured to reduce corrosion of metal included in the power semiconductor component by having a material reactive to one or more corrosive gases to consume at least a portion of the one or more corrosive gases within the encasing, wherein the corrosive gas scavenging component includes a bag or sachet.
1 more element
A device, comprising:
- a power semiconductor component;
- an encasing configured to at least in part encase the power semiconductor component, the encasing including a baseplate configured to support the power semiconductor component, walls surrounding the baseplate, and a top cover, wherein the walls are separable from the baseplate;
- and
- a corrosive gas scavenging component that is attached to an interior surface of the top cover, is encased by the encasing, and is configured to reduce corrosion of metal included in the power semiconductor component by having a material that absorbs one or more corrosive gases to consume at least a portion of the one or more corrosive gases within the encasing, wherein the corrosive gas scavenging component includes a bag or sachet.
1 more element
A method, comprising:
- providing a power semiconductor component;
- encasing the power semiconductor component with an encasing, the encasing including a baseplate configured to support the power semiconductor component, walls surrounding the baseplate, and a top cover, wherein the walls are separable from the baseplate;
- and
- attaching a corrosive gas scavenging component to an interior surface of the top cover within the encasing to reduce corrosion of metal included in the power semiconductor component by having a material reactive to one or more corrosive gases to consume at least a portion of the one or more corrosive gases within the encasing, wherein the corrosive gas scavenging component is encased by the encasing, and wherein the corrosive gas scavenging component includes a bag or sachet.
1 more element
Dependencies are inferred from the claim text.