Micro-electro-mechanical system package and fabrication method thereof
AssigneeVanguard International Semiconductor Corporation
InventorRANGANATHAN NAGARAJAN
Life of this patent
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Abstract
A MEMS package includes a first substrate, an interconnect layer, a getter structure, a MEMS device layer and a second substrate. The interconnect layer is disposed on the first substrate. The getter structure is disposed in both the interconnect layer and the first substrate. The getter structure includes multiple trenches and a getter layer. These trenches pass through the interconnect layer and extend downwards into the first substrate. The getter layer is conformally disposed in these trenches and on the interconnect layer. The MEMS device layer is bonded to the interconnect layer. The second substrate includes a cavity and is bonded to the MEMS device layer.
Claims20
A micro-electro-mechanical system (MEMS) package, comprising:
- a first substrate;
- an interconnect layer, disposed on the first substrate;
- a getter structure, disposed in both the interconnect layer and the first substrate, comprising:
- a plurality of trenches, passing through the interconnect layer and extending downwards into the first substrate;
- and
- a getter layer, conformally disposed in the plurality of trenches and on the interconnect layer;
- a MEMS device layer, bonded to the interconnect layer;
- and
- a second substrate, including a cavity, bonded to the MEMS device layer.
A method of fabricating a micro-electro-mechanical system (MEMS) package, comprising:
- providing a first substrate;
- forming an interconnect layer on the first substrate;
- forming a getter structure in both the interconnect layer and the first substrate;
- providing a second substrate with a cavity formed therein;
- forming a MEMS device layer, bonding to the second substrate and covering the cavity;
- and
- bonding the MEMS device layer to the interconnect layer.
Dependencies are inferred from the claim text.