Method of manufacturing a sensor device
AssigneeMelexis Technologies SA
InventorsRachel Gleeson, Luc Buydens
Life of this patent
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Abstract
A method of manufacturing a sensor device (100) comprises forming (200) a substrate (102) comprising a sensor element followed by forming (202) a cap layer (104). The cap layer (104) is then bonded (204) to the substrate (102) before the substrate (102) is thinned (206). A via is formed (210) between the sensor element and a back side of the thinned substrate (102). An electrical connection is provided between the sensor element and the back side of the thinned substrate (102). A mask is formed (208) on the cap layer (104) to define an area about a predetermined window region (108) before forming (210) of the via. A portion of the cap layer (104) about the predetermined window region (108) of the cap layer (104) is removed (212) after formation (210) of the via.
Claims18
A method of manufacturing a sensor device, the method comprising:
- forming a substrate comprising a sensor element;
- forming a cap layer;
- bonding the cap layer to the substrate;
- thinning the substrate;
- forming a via between the sensor element and a back side of the thinned substrate;
- providing an electrical connection between the sensor element and the back side of the thinned substrate;
- wherein the method further comprises:
- forming a mask on the cap layer to define an area about a predetermined window region before forming of the via;
- and
- removing a portion of the cap layer about the predetermined window region of the cap layer after formation of the via.
A method of manufacturing a sensor device, the method comprising:
- forming a substrate comprising a sensor element;
- forming a cap layer;
- bonding the cap layer to the substrate;
- thinning the substrate;
- forming a via between the sensor element and a back side of the thinned substrate;
- providing an electrical connection between the sensor element and the back side of the thinned substrate;
- wherein the method further comprises:
- forming a mask on the cap layer to define an area about a predetermined window region before formation of the via;
- removing a portion of the cap layer about the predetermined window region of the cap layer before formation of the via;
- and
- replacing the removed portion of the cap layer with another material to restore the cap layer to having a planar structure.
A method of manufacturing a sensor device, the method comprising:
- forming a substrate comprising a sensor element;
- forming a cap layer;
- bonding the cap layer to the substrate;
- thinning the substrate;
- forming a via between the sensor element and a back side of the thinned substrate;
- providing an electrical connection between the sensor element and the back side of the thinned substrate;
- wherein formation of the cap layer comprises:
- providing a first layer of silicon separated from a second layer of silicon by an oxide layer;
- profiling the first layer of silicon in order provide a predetermined window region;
- and
- removing a portion of the second layer of silicon of the cap layer about the predetermined window region to expose a portion of the oxide layer, the portion of the second layer being removed after forming the via.
Dependencies are inferred from the claim text.