Structure and method for embedding a plurality of devices and components into a substrate core

A method for fabricating an integrated circuit (IC) module, the method comprising:

• electrically and mechanically mounting a plurality of devices on an interposer;
• encapsulating the plurality of devices mounted on of the interposer with a molded encapsulation material to form an assembly;
• inserting the assembly in a cavity extending completely through a substrate core;
• and
• securing the assembly in the cavity to form the IC module.

A system in a package (SiP) having at least one integrated circuit (IC) module, comprising:

• a printed circuit board having a first surface and a second surface;
• a chip package coupled to the first surface of the printed circuit board, the chip package having an integrated circuit (IC) mounted on a substrate;
• and
• a power management module mounted to the second surface of the printed circuit board, the power management module comprising:
• a substrate core having a first face, a second face, and a cavity formed in the substrate core and open through the first and second faces of the substrate core;
• an interposer disposed in the cavity and having a first face oriented in a common direction with the first surface;
• a plurality of devices disposed in the cavity and mounted on a second face of the interposer;
• and
• a molded encapsulation material disposed in the cavity and encapsulating the plurality of devices against the second face of the interposer.