Back to results
US 12,713,941 B2Granted
Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorsKatsunori Suzuki, Keishirou Kumada, Yuichiro Hinata, Ryoichi Kato, Masahide Kamiya, Haruka Kamisuki
Life of this patent
Estimating the term…
Abstract
A semiconductor module includes a semiconductor unit including a semiconductor chip, a housing for accommodating the semiconductor unit, and a target member bonded to the housing by an adhesive having a water absorption rate of 0.5% or less.
Claims11
A semiconductor module comprising:
- a semiconductor unit including a semiconductor chip;
- a housing for accommodating the semiconductor unit;
- and
- a target member bonded to the housing by an adhesive having a water absorption rate of 0.5% or less, wherein the housing has a terminal surface having a terminal hole, the terminal hole having an inner wall surface, and, wherein a diameter of the terminal hole at a first position at which the terminal surface is present is greater than a diameter of the terminal hole at a position separated in a depth direction from a position of the terminal surface.
1 more element
A semiconductor module comprising:
- a semiconductor unit including a semiconductor chip;
- a housing for accommodating the semiconductor unit;
- and
- a target member bonded to the housing by an adhesive having a water absorption rate of 0.5% or less,
- wherein the target member includes a first connection terminal and a second connection terminal that are electrically connected to the semiconductor unit,
- wherein the housing has a terminal surface having a recess,
- wherein the recess has a bottom surface, the bottom surface having a first terminal hole and a second terminal hole,
- wherein the first connection terminal protrudes from an inside of the first terminal hole toward an outside of the terminal surface,
- wherein the second connection terminal protrudes from an inside of the second terminal hole toward the outside of the terminal surface, and
- wherein the recess accommodates a second adhesive having a water absorption rate of 0.5% or less.
7 more elements
A semiconductor module comprising:
- a semiconductor unit including a semiconductor chip;
- a housing for accommodating the semiconductor unit;
- a target member bonded to the housing by an adhesive having a water absorption rate of 0.5% or less;
- and
- an auxiliary member, the auxiliary member having a first surface and a second surface,
- wherein the target member includes a first connection terminal and a second connection terminal that are electrically connected to the semiconductor unit,
- wherein the housing has a terminal surface, the terminal surface having a first terminal hole and a second terminal hole,
- wherein the first surface is bonded to the terminal surface by an adhesive having a water absorption rate of 0.5% or less,
- wherein the auxiliary member includes:
- a first recess and a second recess that are on the second surface;
- a first communication hole causing the first recess and the first terminal hole to be in communication with each other;
- and
- a second communication hole causing the second recess and the second terminal hole to be in communication with each other,
- wherein the first connection terminal protrudes from an inside of the first terminal hole toward an outside of the second surface via the first communication hole,
- wherein the second connection terminal protrudes from an inside of the second terminal hole toward the outside of the second surface via the second communication hole, and
- wherein the first recess and the second recess accommodate a second adhesive having a water absorption rate of 0.5% or less.
13 more elements
Dependencies are inferred from the claim text.