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AssigneeIntel Corporation
InventorsLiang He, Jisu Jiang, Jung Kyu Han, Gang Duan, Yosuke Kanaoka, Jason M. Gamba, Bai Nie, Robert Alan May, Kimberly A. Devine, Mitchell Armstrong, Yue Deng
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Embodiments described herein may be related to apparatuses, processes, and techniques for a dam structure on a substrate that is proximate to a die coupled with the substrate, where the dam decreases the risk of die shift during encapsulation material flow over the die during the manufacturing process. The dam structure may fully encircle the die. During encapsulation material flow, the dam structure creates a cavity that moderates the different flow rates of material that otherwise would exert different pressures the sides of the die and cause to die to shift its position on the substrate. Other embodiments may be described and/or claimed.
A package comprising:
A method comprising:
Dependencies are inferred from the claim text.