Encapsulation techniques
AssigneeElta Systems Ltd.
InventorsItzhak Shapir, Michael Kedem
Life of this patent
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Abstract
An integrated circuit (IC) assembly and a method for encapsulating of IC are presented. The IC assembly comprises an IC substrate having one or more micro-devices, at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices; and an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate.
Claims15
An integrated circuit (IC) assembly, comprising:
- an IC substrate having one or more micro-devices;
- at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices;
- and
- an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate;
- and
- at least one spacer element placed on the at least one dielectric matrix element, the at least one spacer element partitioning between the at least one dielectric matrix element and the encapsulation element, and
- wherein the at least one spacer element is a detached portion removed from an aligning element configured to accurately place the at least one dielectric matrix element on the IC substrate;
- and
- wherein the at least one dielectric matrix element comprises a plurality of loop, hook, and/or bristle elements.
A multilayered circuit structure, comprising:
- at least one integrated circuit (IC) assembly and at least one additional circuit board having one or more devices and/or ICs attached thereto, the at least one IC assembly comprising:
- an IC substrate having one or more micro-devices;
- a circuit board electrically coupled to the IC substrate and its one or more micro-devices;
- at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices;
- and
- an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate;
- wherein said at least one additional circuit board is attached and electrically coupled to said at least one IC assembly to form a stack structure.
A method of encapsulating an integrated circuit (IC) including one or more micro-devices, the method comprising:
- placing at least one dielectric matrix element on an IC substrate over at least one of one or more micro-devices thereof;
- and
- applying an encapsulation mold over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate;
- wherein the placing of the at least one dielectric matrix element comprises attaching the at least one dielectric matrix element to a carrier element configured to facilitate accurate placement of the at least one dielectric matrix element on the IC substrate.
Dependencies are inferred from the claim text.