H10W 76/47
Solid or gel fillings
H10W76/47 (Solid or gel fillings) appears on 1,411 US grants and 1,496 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,411
- Published applications
- 1,496
- Assignees
- 423
- Inventors
- 2,922
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 7 | 0 |
| 1990 | 3 | 0 |
| 1991 | 8 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 11 | 0 |
| 1995 | 16 | 0 |
| 1996 | 15 | 0 |
| 1997 | 22 | 0 |
| 1998 | 36 | 0 |
| 1999 | 47 | 0 |
| 2000 | 51 | 0 |
| 2001 | 31 | 20 |
| 2002 | 39 | 38 |
| 2003 | 24 | 21 |
| 2004 | 30 | 38 |
| 2005 | 30 | 41 |
| 2006 | 34 | 46 |
| 2007 | 27 | 39 |
| 2008 | 20 | 28 |
| 2009 | 27 | 33 |
| 2010 | 26 | 36 |
| 2011 | 23 | 30 |
| 2012 | 27 | 41 |
| 2013 | 37 | 58 |
| 2014 | 25 | 50 |
| 2015 | 66 | 61 |
| 2016 | 55 | 66 |
| 2017 | 54 | 58 |
| 2018 | 58 | 65 |
| 2019 | 73 | 89 |
| 2020 | 69 | 76 |
| 2021 | 63 | 104 |
| 2022 | 62 | 104 |
| 2023 | 71 | 118 |
| 2024 | 67 | 98 |
| 2025 | 63 | 89 |
| 2026 | 49 | 49 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Encapsulation techniques22 Sep 2026US 12,745,670 B2Elta Systems Ltd.
- Semiconductor module18 Aug 2026US 12,713,941 B2Fuji Electric Co., Ltd.
- Semiconductor devices and methods of manufacturing semiconductor devices18 Aug 2026US 12,713,969 B2Amkor Technology Singapore Holding Pte.Ltd.
- Substrate11 Aug 2026US 12,708,003 B2Infineon Technologies AG
- Package with molding cavity11 Aug 2026US 12,708,024 B2Semiconductor Components Industries, LLC
- Integrated circuit (ic) package having a package mold layer and a stiffener in the package mold layer to reduce warpage17 Sep 2026US 2026/0283009 A1QUALCOMM Incorporated
- Embedded cooling systems for advanced device packaging27 Aug 2026US 2026/0255962 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor device20 Aug 2026US 2026/0248030 A1Kabushiki Kaisha Toshiba
- Electronic component and method for mounting an electronic component13 Aug 2026US 2026/0239999 A1ams-OSRAM International GmbH
- Epoxy resin composition, electronic component, semiconductor device, and semiconductor device manufacturing method6 Aug 2026US 2026/0231817 A1Namics Corporation
Most cited
By later US patents
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Semiconductor package and method thereof328US 5,776,798 AMotorola, Inc. · 1998
- Method of making a cavity ball grid array apparatus317US 6,326,244 B1Micron Technology, Inc. · 2001
- Encapsulation package and method of packaging an electronic circuit module314US 6,534,711 B1The Goodyear Tire & Rubber Company · 2003
- Anchoring method for flow formed integrated circuit covers286US 5,336,931 AMotorola, Inc. · 1994