Epoxy resin composition, electronic component, semiconductor device, and semiconductor device manufacturing method
AssigneeNamics Corporation
InventorsYu SAITO, Takayuki OE, Tsuyoshi KAMIMURA
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Abstract
To provide an epoxy resin composition capable of suppressing small pores generated when a surface of a cured product is polished, an electronic component using the epoxy resin composition, a semiconductor device using the epoxy resin composition, and a method for manufacturing the semiconductor device. The epoxy resin composition includes an epoxy resin, a curing accelerator, a filler, and an elastomer. The elastomer is at least one selected from a solid elastomer and a liquid elastomer, and the solid elastomer has a structure having no double bond in the main chain.
Claims20
An epoxy resin composition comprising an epoxy resin, a curing accelerator, a filler, and an elastomer, wherein
- the elastomer is at least one selected from a solid elastomer and a liquid elastomer, and
- the solid elastomer has a structure having no double bond in a main chain.
Dependencies are inferred from the claim text.