Electronic component and method for mounting an electronic component

An electronic component comprising:

• a housing with a moldable material;
• a leadframe embedded in the moldable material;
• and
• an electronic semiconductor chip,
• wherein the housing has a mounting surface and outer walls,
• wherein the leadframe has a top side and a bottom side situated opposite the top side,
• wherein the leadframe has at least two separate leadframe portions,
• wherein the leadframe portions form chip contact pads on the top side,
• wherein the leadframe has solder contact structures connected to the leadframe portions,
• wherein the solder contact structures are arranged in regions of housing corners formed at the mounting surface, and are accessible at the mounting surface and/or the outer walls,
• wherein portions of the solder contact structures, which are accessible at the mounting surface and/or at the outer walls of the housing, form first solder contact surfaces,
• wherein the electronic semiconductor chip is connected to a first leadframe portion and a second leadframe portion by a bonding wire, respectively, and
• wherein the electronic semiconductor chip is electrically contacted with the first leadframe portion and the second leadframe portion such that both bonding wires project from the electronic semiconductor chip in a direction of a common outer wall.